Time-Domain Reflectometry Analysis on Low Impedance Marginal Failure and multi-chip Modules

Saku, Leena; Radhamony, Rahul Babu; Soriano, Andrea Michelle; Tan, Grace Hwei Ching; Shang, Yang

doi:10.1109/eptc56328.2022.10013181

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Time-Domain Reflectometry Analysis on Low Impedance Marginal Failure and multi-chip Modules

Cited by 4 publications

References 2 publications

TDR Technology Detects Solder Joint Cracking of BGA Packaged Device

TDR Technology Detects Solder Joint Cracking of BGA Packaged Device

A preliminary study on the Soft Defects Modeling and Measurement Method using Time-domain Reflectometry

3D System-in-Package Failure Analysis by High-Resolution Time-Domain Reflectometry

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