Through mold interconnects for fan-out wafer level package

Ho, Soon Wee; Wai, Leong Ching; Sek, Soon Ann; Cereno, Daniel Ismael; Lau, Boon Long; Hsiao, Hsiang-Yao; Chai, Tai Chong; Rao, Vempati Srinivasa

doi:10.1109/eptc.2016.7861441

Cited by 12 publications

(1 citation statement)

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“…Therefore, various approaches have been developed to reduce the cost and increase the density of through-molded interconnects. [19][20][21] Vertical wire bonding is one of the technologies to achieve lower production costs and improve high-density interconnections. [22][23][24] These process schemes are called "Pillar First."…”

Section: Introductionmentioning

confidence: 99%

3D integration technology with photosensitive mold for fan-out package

Yamashita

Sekiguchi

2021

Jpn. J. Appl. Phys.

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An innovative 3D packaging and integration technology with a newly developed photosensitive mold material was successfully demonstrated. This technology needs neither a tall Cu pillar electroplating nor a laser drilling. A test die was mounted face up on a substrate, then a more than 100 μm thick photosensitive mold film was laminated on the whole substrate. The lithography process on the mold film was executed to make openings with depth of 10 μm on the embedded die, and with depth of 110 μm on the substrate. The Cu redistribution layer formed the electrical contacts between the die and the substrate through the photosensitive vias with different diameters and depths. The developed 3D package passed 1000 thermal cycles at −55/125 °C. This work disclosed future capability of a fan-out process using a photosensitive mold, thereby realizing a rapid growth of 3D integrated modules.

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Section: Introductionmentioning

confidence: 99%