2004
DOI: 10.1063/1.1805196
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Threshold voltage instability characteristics under positive dynamic stress in ultrathin HfO2 metal-oxide-semiconductor field-effect transistors

Abstract: Articles you may be interested inInvestigation of abnormal negative threshold voltage shift under positive bias stress in input/output n-channel metal-oxide-semiconductor field-effect transistors with TiN/HfO2 structure using fast I-V measurement Appl. Phys. Lett.Abnormal threshold voltage shift under hot carrier stress in Ti1−xNx/HfO2 p-channel metal-oxide-semiconductor field-effect transistors Abnormal interface state generation under positive bias stress in TiN/HfO2 p-channel metal-oxide-semiconductor field… Show more

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Cited by 7 publications
(3 citation statements)
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“…While recent efforts have achieved significant progress in improving the electrical characteristics of organic TFT devices , operational stability remains a major issue to be resolved before organic TFT devices are commercialized for practical applications. In some TFT devices, excess charges induced by the gate electric field are believed to fall into trap states over time with continuous device operation, a behavior known as the bias‐stress effect, which is an obstacle to the long‐term operational stability for organic TFT devices, as well as those based on a‐Si:H, poly‐Si, and metal‐oxide semiconductor materials . Bias‐stress effects are largely attributed to the trapping of carriers from a gate bias‐induced conduction channel into localized electronic states .…”
Section: Introductionmentioning
confidence: 99%
“…While recent efforts have achieved significant progress in improving the electrical characteristics of organic TFT devices , operational stability remains a major issue to be resolved before organic TFT devices are commercialized for practical applications. In some TFT devices, excess charges induced by the gate electric field are believed to fall into trap states over time with continuous device operation, a behavior known as the bias‐stress effect, which is an obstacle to the long‐term operational stability for organic TFT devices, as well as those based on a‐Si:H, poly‐Si, and metal‐oxide semiconductor materials . Bias‐stress effects are largely attributed to the trapping of carriers from a gate bias‐induced conduction channel into localized electronic states .…”
Section: Introductionmentioning
confidence: 99%
“…The observation of gate bias stress has been reported for widely different material systems, 2-6 such as OTFTs based on silicon oxide (SiO 2 ), 7,8 organic dielectric layers, [9][10][11] as well as for thin-film transistors using a-Si:H, poly-Si, and metal-oxide semiconductor materials. [12][13][14][15][16] Equation (1) describes this stretched exponential decay, where V T,max is the maximum threshold shift after infinite time, s is the time constant, and b is the stretching exponent…”
mentioning
confidence: 99%
“…The bias stress (BS) instability is often observed as degradation in drain current owing to negative threshold voltage shift. [1][2][3][4] The current degradation is caused by charge trapping at the semiconductor/insulator interface [5][6][7] or contact regions. 8,9) Various insulating materials of OTFTs have been investigated in order to reduce the BS instability, such as SiO 2 with a self-assembling monolayer, 5,10) CYTOPÔ, 11) and polyimide (PI).…”
Section: Introductionmentioning
confidence: 99%