Three-dimensional waveguide arrays for coupling between fiber-optic connectors and surface-mounted optoelectronic devices

Hiramatsu, S.; Kinoshita, Moto

doi:10.1109/jlt.2005.853154

Cited by 10 publications

(6 citation statements)

References 20 publications

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“…However, vertical alignment along was passive, since the glass wafer thicknesses could be controlled to very high accuracy. These last two features significantly differentiate the work reported in [6] from our work presented here. First, in our work the thickness of the polymer lower cladding, core and upper cladding layers is controlled by the spin coating fabrication step giving a maximum of 10% variation in the thickness of each layer.…”

Section: B Practical Self-alignment Techniquesupporting

confidence: 48%

“…An interesting technique to align waveguide arrays to 2-D arrays of VCSELs and PDs using MT ferrules was reported in [6]. In that approach, waveguides were formed in a grid pattern on several glass wafers, which were aligned above each other with the aid of visual alignment marks and subsequently laminated.…”

Section: B Practical Self-alignment Techniquementioning

confidence: 99%

“…The authors of [6] reported a 1.6 dB insertion loss for their waveguide to waveguide connector but the waveguides were polished and active lateral alignment was used. A loss of 0.6 dB was reported in [14], for a multimode fiber to flexible film waveguide connector, with index-matching fluid and polished waveguides.…”

Section: B Loss Componentsmentioning

confidence: 99%

“…Mechanically transferable (MT) plugs and sockets have been used by several research groups [5], [6], [14], [15] as a basis for making connectors as they are easily fabricated and have two long registration pins and guide holes which give good translational and angular alignment of the plug to the socket. VCSELs can easily and accurately be cleaved singly or as arrays along cleaving lines and located against raised alignment features or projections in the plug.…”

mentioning

confidence: 99%

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Low-Cost, Precision, Self-Alignment Technique for Coupling Laser and Photodiode Arrays to Polymer Waveguide Arrays on Multilayer PCBs

Papakonstantinou

Selviah

Pitwon³

et al. 2008

IEEE Trans. Adv. Packag.

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Abstract-The first, to our knowledge, passive, precision, selfalignment technique for direct coupling of vertical cavity surface emitting laser (VCSEL) and photodiode (PD) arrays to an array of polymer buried channel waveguides on a rigid printed circuit board (PCB) is reported. It gives insertion losses as good as the best achieved previously, to within experimental measurement accuracy, but without the need for costly active alignment nor waveguide facet polishing and so is a major step towards a commercially realizable low cost connector. Such an optical connector with four duplex channels each operating at 10 Gb/s (80 Gb/s aggregate) was designed, constructed, and its alignment precision assessed. The alignment technique is applicable to polymer waveguide interconnections on both rigid and flexible multilayer printed circuit boards (PCBs). The dependence of optical coupling loss on misalignments in , and of the VCSEL and PD arrays allows the precision of alignment to be assessed and its reproducibility on multiple mating cycles of the connector is reported. The first recorded measurements of crosstalk between waveguides when the connector is misaligned are reported. Lateral misalignments of the connector to within its tolerance are shown to have no effect on the signal to crosstalk ratio (SCR), to within experimental measurement accuracy. The insertion loss repeatability is similar to that of single mode fiber mechanically transferable (MT) connectors.

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Section: B Practical Self-alignment Techniquesupporting

confidence: 48%

Section: B Practical Self-alignment Techniquementioning

confidence: 99%

Section: B Loss Componentsmentioning

confidence: 99%

mentioning

confidence: 99%

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Low-Cost, Precision, Self-Alignment Technique for Coupling Laser and Photodiode Arrays to Polymer Waveguide Arrays on Multilayer PCBs

Papakonstantinou

Selviah

Pitwon³

et al. 2008

IEEE Trans. Adv. Packag.

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“…For 4xN-arrays, however, one can also map a sparse 2D-array (250 µm pitch) to a dense 1D array (62.5 µm pitch), which allows to circumvent the issue, but requires a more complex mirror-array structure. Alternatively, the 90°-bend can be done using other optical elements, for example 'optical pins' which are essentially short pieces of waveguides with a 45°-mirror on one end, assembled vertically into the board [36], or '2D waveguide cubes' consisting of stacked waveguide plates [37]. While such approaches can eliminate the distance limitation, they clearly suffer from a more complex (and therefore more costly) board-side optics.…”

Section: Coupling Into and Out Of The Optical Channelmentioning

confidence: 99%

Challenges for the introduction of board-level optical interconnect technology into product development roadmaps

2006

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Optical interconnects have gradually replaced electrical interconnects in the long-distance telecom, local-area, and rackto-rack link classes. We believe that this transition will also happen in the card-backplane-card datacom link class, both for bandwidth*length reasons and for density reasons. In analogy to the transition from individually wired boards to integrated printed circuit boards, we believe that eventually board-level optical interconnects will be based on an integrated technology such as board-embedded waveguides. In order to bring optical waveguide technology into mainstream product development plans, however, numerous challenges on many levels have to be met. Problems to be tackled span from the base level of materials (stability, processability) and devices (reliability, lifetime), over the subsystem level of packages (concepts, cost-efficient assembly and alignment) all the way up to the system level (link architecture, system packaging, heat management). A sustainable solution can only be reached if the development of all individual technology components is done with the whole system in mind. Important figures of merit are the cost per gigabit per second, the power per gigabit per second, and the maturity/reliability of the technology. We will give an overview of our optical interconnect activity, with respect to these challenges. We will discuss the options, explain our technology decisions and present some results of our multi-disciplinary activity.

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Compact Three-Dimensional Waveguide Array Connectors for Extremely High-Definition (EHD) Display System

Hiramatsu

Ichiyoshi

2006

2006 European Conference on Optical Communications

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Three-dimensional waveguide arrays for coupling between fiber-optic connectors and surface-mounted optoelectronic devices

Cited by 10 publications

References 20 publications

Low-Cost, Precision, Self-Alignment Technique for Coupling Laser and Photodiode Arrays to Polymer Waveguide Arrays on Multilayer PCBs

Low-Cost, Precision, Self-Alignment Technique for Coupling Laser and Photodiode Arrays to Polymer Waveguide Arrays on Multilayer PCBs

Challenges for the introduction of board-level optical interconnect technology into product development roadmaps

Compact Three-Dimensional Waveguide Array Connectors for Extremely High-Definition (EHD) Display System

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