2000
DOI: 10.1002/pen.11207
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Three‐dimensional simulation of microchip encapsulation process

Abstract: A finite element simulation of moving boundaries in a three‐dimensional inertiafree, incompressible flow is presented. A control volume scheme with a fixed finite element mesh is employed to predict fluid front advancement. Fluid front advancement and pressure variation in a flow domain similar to the mold cavity used for microchip encapsulation are predicted. The predicted fluid front advancement and pressure variation are in good agreement with the corresponding experimental results. As the difference in the… Show more

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Cited by 34 publications
(13 citation statements)
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“…Physical models, which establish a physical understanding of the manufacturing process and deploy the various physical laws, can be used to represent these relationships between process variables and process responses for manufacturing processes such as epoxy dispensing (Li et al 2001, Chen 2002, injection moulding process (Chiang et al 1991), solder paste dispensing process (Geren and Ekere 1994) and transfer moulding process (Han et al 2000). However, physical models usually consist of partial differential equations with respect to both process variables and process responses, which may not be developed easily due to the complex behaviour of certain manufacturing processes.…”
Section: Introductionmentioning
confidence: 99%
“…Physical models, which establish a physical understanding of the manufacturing process and deploy the various physical laws, can be used to represent these relationships between process variables and process responses for manufacturing processes such as epoxy dispensing (Li et al 2001, Chen 2002, injection moulding process (Chiang et al 1991), solder paste dispensing process (Geren and Ekere 1994) and transfer moulding process (Han et al 2000). However, physical models usually consist of partial differential equations with respect to both process variables and process responses, which may not be developed easily due to the complex behaviour of certain manufacturing processes.…”
Section: Introductionmentioning
confidence: 99%
“…This can be achieved by developing appropriate physical models to represent the manufacturing process. Physical models [5,9,12,29] are based on a physical understanding of the process, and they typically consist of a set of governing partial differential equations. They are attractive because they provide a fundamental understanding of the relationships between the input and output parameters.…”
Section: Introductionmentioning
confidence: 99%
“…On establishing the three‐dimensional CAE simulation program, various attempts to predict the actual processing condition in injection molding were reported. Attention has been primarily paid to the analysis of the melt temperature distributions, pressure generated during mold filling, and velocity of the melt injected . Undeniably, it is crucial to determine the rheological data in order to observe the behavior of polymeric materials.…”
Section: Introductionmentioning
confidence: 99%