Three-dimensional simulation of intermetallic compound layer growth in a binary alloy system

Phase field modeling the growth of Ni3Al layer in the β/γ diffusion couple of Ni–Al binary system

“…2(b), which could be regarded as a parabolic growth kinetics. This also agrees well with the result presented by Kim et al [10] that the growth of intermetallic layer obeys parabolic law if only considering the volume diffusion of three phases.…”

“…For these two cases, the grain boundary diffusion acts as fast diffusion path to accelerate the growth of Ni 3 Al layer, so the growth of Ni 3 Al layer is actually controlled by both grain boundary diffusion and volume diffusion, leading to nonparabolic growth kinetics. This accords with experimental results obtained by Schaefer et al [16] and Ghosh [17] as well as other phase field simulations [10,11], proving that the growth kinetics of an intermetallic compound phase would deviate from parabolic growth when the grain boundary diffusion is taken into account. taken into account, a migration of Ni 3 Al grain boundary which is perpendicular to the direction of diffusion path, as reported by Gust et al [18] and Glitz et al [2], is also observed, as shown in Figs.…”

“…However, the researches above mainly concentrate on the transformation between two phases, not involving the transformation among multiphase and the generation of a new phase during transformation. Using the multiphase field method, Kim et al [10] simulated the growth process of an intermetallic compound phase in a binary model alloy in three dimensions, and studied the influences of grain boundary diffusion on the shape evolution and growth kinetics of the compound phase. They concluded that grain boundary diffusion can accelerate the growth of the intermetallic compound phase and induce the deviation of the growth kinetics from the parabolic law, which challenges the conclusions declared by Janssen [1] and Glitz et al [2].…”

A phase-field study on the formation of the intermetallic Al2Au phase in the Al–Au system

“…Moreover, the above mentioned studies are in two spatial dimensions. As far as we know, there are very few 3D phase-field studies on intermetallic compounds [25] and no literature has been found for the investigation of Al-Au system using phase-field modeling. In addition to the 3D phase-field modeling as well as the ternary phase diagram extension, we present a new concept that the lateral spreading of the intermetallic phase is due to wetting, which differs from the idea of grain boundary diffusion.…”

Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process

“…The failure of solder joints often occurs at the interface between the IMC and solder or between the IMC and metallic substrate, and consequently leads to loss of function in interconnects and results in product failure. So far, there has been increasing attention towards the study of formation, growth and morphology evolution of interfacial IMC phases in lead-free solder joints by experimental characterization and numerical simulation [7][8][9][10][11][12][13][14][15]. According to the thermodynamics theory [8], at the initial stage of the metallic substrate (such as Cu or Ni) contacting to the molten solder, the metallic atoms rapidly dissolve into the molten solder and quickly become supersaturated in the interface regions; and subsequently the IMC phases start to nucleate and grow at the interface due to the local metastable equilibrium solubility of metallic atoms in the liquid solder alloy.…”