Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Tummala, Vana Snigdha; Mian, Ahsan; Chamok, Nowrin H.; Poduval, Dhruva; Ali, Mohammod; Clifford, Jallisa; Majumdar, Parthasarathi

doi:10.1115/1.4036384

Cited by 4 publications

(1 citation statement)

References 17 publications

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“…24 Our group used this EM modeling scheme for patch antenna created on porous rigid substrates and compared with experimental results. 3,25 A good agreement was observed between the experimental and EM modeling results confirming the adopted numerical scheme. A 3D modeler window is utilized to model the object as shown in Figure 1.…”

Section: Modeling Of Unstressed Structure For Resonant Frequencysupporting

confidence: 67%

Radio frequency response of flexible microstrip patch antennas under compressive and bending loads using multiphysics modeling approach

Hamad

Mian

2018

Int J RF Microw Comput Aided Eng

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This research article studies the effect of compression and bending loads on resonant frequency of microstrip patch antennas using COMSOL Multiphysics software (will be called COMSOL hereafter). In this study, copper microstrip patch antenna of dimension 30 mm × 25 mm on polydimethylsiloxane (PDMS) substrate of dimension 50 mm × 50 mm is considered. The interface bonding is assumed to be ideal between the patch and substrate. Both Ansoft HFSS and COMSOL are used to model and analyze the original geometry of the microstrip patch antenna without applying physical load to make sure that the design and the impedance match is satisfactory. Then, COMSOL is used to find deformed shape of the microstrip patch antenna under different values of compression and bending loads. The deformed geometries are reanalyzed using COMSOL radio frequency (RF) simulation. The resonant frequencies at different load levels are obtained and the effect of loading and boundary conditions on the resonant frequency shift is discussed.

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Section: Modeling Of Unstressed Structure For Resonant Frequencysupporting

confidence: 67%

Radio frequency response of flexible microstrip patch antennas under compressive and bending loads using multiphysics modeling approach

Hamad

Mian

2018

Int J RF Microw Comput Aided Eng

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Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Cheng

Hong

Chen

2018

Journal of Electronic Packaging

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In this work, the elastic–plastic properties of the printed interconnects on a glass substrate with Ag-filled polymer-conductor ink are evaluated through a theoretical framework based on finite element (FE) modeling of instrumented sharp indentation, experimental indentation, the concept of the representative strain, and dimensional analysis. Besides, the influences of the ink-solvent content and temperature on the elastic–plastic and electrical properties of the printed Ag-based interconnects are also addressed. First of all, parametric FE indentation analyses are carried out over a wide range of elastic–plastic material parameters. These parametric results together with the concept of the representative strain are used via dimensional analysis to constitute a number of dimensionless functions, and further the forward/reverse algorithms. The forward algorithm is used for describing the indentation load–depth relationship and the reverse for predicting the elastic–plastic parameters of the printed Ag-based interconnects. The proposed algorithms are validated through the correct predictions of the plastic properties of three known metals. At last, their surface morphology, microstructure, and elemental composition are experimentally characterized. Results show that the elastic–plastic properties and electrical sheet resistance of the printed Ag-based interconnects increase with the ink-solvent content, mainly due to the increase of carbon element as a result of the increased ink-solvent residue, whereas their elastic–plastic properties and electrical performance decreases with the temperature.

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Layer-to-layer physical characteristics and compression behavior of 3D printed polymer metastructures fabricated using different process parameters

Patibandla

Mian

2020

Journal of Elastomers & Plastics

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The extrusion-based three-dimensional printing technology such as fused deposition modeling (FDM) is the widely used one owing to its low cost. The FDM method can be used to fabricate parts with different fill densities, fill patterns, and process parameters such as extrusion temperature and print speed. In this research, influence of process parameters such as extrusion temperature and print speed on the physical characteristics such as the shape and the size of printed fibers in each layer, the fiber distance, and the fiber-to-fiber interface are investigated. In addition, their effects on mechanical characteristics of the printed samples are examined and interpreted with respect to the layer physical characteristics. To accomplish this, metastructure specimens were fabricated using acrylonitrile butadiene styrene polymer on a MakerBot 2X Replicator 3D printer. Three different extrusion temperatures (210, 230, and 250°C) and print speeds (100, 125, and 150 mm/s) were considered with an infill density of 50%. Optical microscopy was performed for layer physical characterization while the compression tests were done to evaluate the mechanical properties such as the failure strength, yield strength, and compressive modulus. It is observed that the print speed has minimal effect on mechanical properties; however, an improvement in mechanical properties is observed at higher fabrication temperature. Also, the lower fabrication temperature results in more uniform features within the layers as compared to those printed at higher extrusion temperature.

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Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Cited by 4 publications

References 17 publications

Radio frequency response of flexible microstrip patch antennas under compressive and bending loads using multiphysics modeling approach

Radio frequency response of flexible microstrip patch antennas under compressive and bending loads using multiphysics modeling approach

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Layer-to-layer physical characteristics and compression behavior of 3D printed polymer metastructures fabricated using different process parameters

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