Three-Dimensional Photochemical Machining

Allen, D.M.; Brightman, J.R.C.; Gillbanks, P.J.; Smith, P.; Crookall, J.R.

doi:10.1016/s0007-8506(07)62561-x

Cited by 9 publications

(2 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Though exposure equipment and photo-tools for nonplanar substrates exist, these are specific to each geometry. 52,119,[125][126][127][128][129] Oxide films.-In response to the drawbacks of traditional photoresists and photolithography processes, resists based on oxide films, so-called oxyresists, were developed. 130 The oxyresist technology exploits the fact that some metals like aluminum and titanium natu-rally form adherent, passivating, nanometer-thin oxide films.…”

Section: Masking Methods and Materialsmentioning

confidence: 99%

Review—Through-Mask Electrochemical Micromachining

Baldhoff

Nock

Marshall

2018

J. Electrochem. Soc.

View full text Add to dashboard Cite

Through-mask electrochemical micromachining (TMEMM) is a versatile microfabrication technique, which combines anodic metalshaping and -finishing steps in a single operation for the purpose of microstructuring a wide range of electrically conductive materials. It has been extensively utilized for the manufacture of precision-engineered components in microsystems, such as microlenses, microprobes, microactuators, microchannels and microvalves. This is because TMEMM is able to mass-produce parts; it is applicable to difficult-to-etch materials and operable under polishing conditions. This review provides an in-depth summary of the current state of TMEMM and presents key concepts relevant to its application. To this end, the interplay between the current distribution, mass-transfer effects and surface-film formation is discussed, and its effect on the machining rate, shape profile and surface finish is highlighted. Also, past incarnations of TMEMM are reviewed in terms of their masking method, substrate material, electrolyte composition and technical application. Techno-economic aspects of TMEMM are debated in relation to potential rival techniques, taking microreactor fabrication as an example for a novel area of application. This is followed by an overview of process variations and recent developments.

show abstract

Section: Masking Methods and Materialsmentioning

confidence: 99%

Review—Through-Mask Electrochemical Micromachining

Baldhoff

Nock

Marshall

2018

J. Electrochem. Soc.

View full text Add to dashboard Cite

show abstract

“…3. Although usually associated with the production of planar components, PCM may be used to etch the surfaces of three-dimensional components based on cylindrical, conical, or spherical geometry [7]. 4.…”

Section: Process Capabilitymentioning

confidence: 99%

Imaging Technology, 5. Photochemical Machining

Allen

2011

Ullmann's Encyclopedia of Industrial Chemistry

View full text Add to dashboard Cite

The article contains sections titled: 1. Introduction 2. Artwork Generation and Phototool Production 3. Materials 4. Photoresist Systems 5. Etching Technology 6. Process Capability 7. Economic Aspects 8. Products

show abstract