2021
DOI: 10.1016/j.ceramint.2021.08.346
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Three-dimensional micro-pipelines high thermal conductive C/SiC composites

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Cited by 9 publications
(8 citation statements)
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“…The reason can be ascribed to the unique microstructure and high thermal conductivity character between PAN carbon and pitch‐based carbon fibers. According to our previous report, 36 the cross‐section of PAN carbon fiber showed a large amorphous structure area with flat and smooth morphology, while the pitch‐based carbon fiber displayed a rough and fold structure surface coupled with some fragmentations on the edge of the fiber (Figure 10A–C). 36 According to previous reports, the fold structure is beneficial for heat conduction 37,38 .…”
Section: Resultssupporting
confidence: 63%
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“…The reason can be ascribed to the unique microstructure and high thermal conductivity character between PAN carbon and pitch‐based carbon fibers. According to our previous report, 36 the cross‐section of PAN carbon fiber showed a large amorphous structure area with flat and smooth morphology, while the pitch‐based carbon fiber displayed a rough and fold structure surface coupled with some fragmentations on the edge of the fiber (Figure 10A–C). 36 According to previous reports, the fold structure is beneficial for heat conduction 37,38 .…”
Section: Resultssupporting
confidence: 63%
“…According to our previous report, 36 the cross‐section of PAN carbon fiber showed a large amorphous structure area with flat and smooth morphology, while the pitch‐based carbon fiber displayed a rough and fold structure surface coupled with some fragmentations on the edge of the fiber (Figure 10A–C). 36 According to previous reports, the fold structure is beneficial for heat conduction 37,38 . The inserted XRD pattern presented in Figure 10 also revealed a difference between the two types of fibers.…”
Section: Resultssupporting
confidence: 63%
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“…由于纤维预制体的结构特点,纤维增强碳化硅 陶瓷基复合材料沿厚度方向,碳纤维与基体之间结 合较弱,热输运能力较面内方向弱,面内热导率约 是沿厚度热导率的 10~100 倍 [60] , 热导率各向异性。 研究者围绕高导热填料的均匀分散以及如何构建连 续有效的导热通路,进行了诸多探索。 Zhang 等 [61] 首先采用化学气相渗透工艺制备出 二维碳纤维增强碳化硅陶瓷基复合材料,厚度方向 经连续微波激光(Continuous Wave Laser)打孔后,注 射多层石墨烯溶液用以构筑厚度方向连续导热通道, 最后经化学气相渗透工艺增密(如图 10 所示) ,使 碳纤维增强碳化硅陶瓷基复合材料的热导率提高了 204%,为 设计、制备连续纤维增强高导热碳化硅陶 瓷基复合材料提供了一种新的有效方法。 图 10 含石墨烯-碳纤维增强碳化硅陶瓷基复合材料导热通路设计 [61] Fig. 10 Design of heat conductive channels of Cf/SiC with well-designed graphene [61] Zhang 等 [62] [62] Fig. 11 Structural design of three-dimensional-linked Cf/SiC with micro-pipelines [62] Chen 等 [52] 通过在碳纤维表面分层生长垂直排 列的碳纳米管(CNTs),如图 12 所示,堆垛以形成三 维预制体结构,然后经聚合物浸渍裂解工艺制备得 到碳化硅陶瓷基复合材料,其厚度热导率从 7.94 W/(m• K)提高到 16.80 W/(m• K)。 图 12 碳纳米管-碳纤维微观组织 [52] Fig.…”
Section: 结构设计提高热导率unclassified
“…10 Design of heat conductive channels of Cf/SiC with well-designed graphene [61] Zhang 等 [62] [62] Fig. 11 Structural design of three-dimensional-linked Cf/SiC with micro-pipelines [62] Chen 等 [52] 通过在碳纤维表面分层生长垂直排 列的碳纳米管(CNTs),如图 12 所示,堆垛以形成三 维预制体结构,然后经聚合物浸渍裂解工艺制备得 到碳化硅陶瓷基复合材料,其厚度热导率从 7.94 W/(m• K)提高到 16.80 W/(m• K)。 图 12 碳纳米管-碳纤维微观组织 [52] Fig. 12 Microstructure of the CNTs-carbon fiber [52] Pan 等 [63] 首先采用化学气相渗透工艺制备二维 碳纤维增强碳化硅复合材料,厚度方向通过激光打 孔定向引入高导热碳纳米管以构建三维连续导热通 路,如图 13 所示,最后经化学气相渗透增密后得 图 13 定向碳纳米管-碳纤维增强碳化硅陶瓷基复合材料结 构设计 [63] Fig.…”
Section: 结构设计提高热导率unclassified