2023
DOI: 10.1016/j.est.2023.108233
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Three-dimensional Lattice Boltzmann study on structure optimization and heat dissipation performance of pin-fin heat sink integrated with phase change material

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Cited by 7 publications
(1 citation statement)
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“…As far as the phase change material (PCM) heat sink with pin-n is concern, it is one of the cooling rate enhancing elements and is under investigation by the eminent researchers, worldwide. After conducting optimization research on triangular pin-n arrangements, the full melt time was shortened by 14.3% and the heat dissipation power was increased by up to 15.2%, when compared with the PCM heat sink with triangular pin-ns, H. Pan et al [11]. In the investigation of heat transfer performance for through-silicon via embedded in micro pin ns in 3D integrated chips, it is obtained by the W. He et al [12] that the best comprehensive heat transfer performance was achieved with an extended n angle of 30 degrees for the micro pin ns.…”
Section: Introductionmentioning
confidence: 99%
“…As far as the phase change material (PCM) heat sink with pin-n is concern, it is one of the cooling rate enhancing elements and is under investigation by the eminent researchers, worldwide. After conducting optimization research on triangular pin-n arrangements, the full melt time was shortened by 14.3% and the heat dissipation power was increased by up to 15.2%, when compared with the PCM heat sink with triangular pin-ns, H. Pan et al [11]. In the investigation of heat transfer performance for through-silicon via embedded in micro pin ns in 3D integrated chips, it is obtained by the W. He et al [12] that the best comprehensive heat transfer performance was achieved with an extended n angle of 30 degrees for the micro pin ns.…”
Section: Introductionmentioning
confidence: 99%