Three-dimensional kinematical analyses for surface grinding of large scale substrate

Zhou, Libo; Shimizu, Jun; Shinohara, Kazuhiro; Eda, Hiroshi

doi:10.1016/s0141-6359(02)00225-8

Cited by 37 publications

(16 citation statements)

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“…A kinematical analysis is useful to address the behavior of each grain in wafer surface generation (Zhou, et al, 2002, 2003, Chen and Hsu, 2006, 2008. The 3D model of rotational in-feed grinding method is shown in Fig.…”

Section: Kinematical Analyses 31 3d Cutting Path and Resultant Wafermentioning

confidence: 99%

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Process study on large-size silicon wafer grinding by using a small-diameter wheel

Ebina

Yoshimatsu

Zhou

et al. 2015

JAMDSM

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Silicon (Si) is a fundamental material in the semiconductor industry. The advancement of semiconductor devices have offered convenience and comfort to our life. In order to raise productivity and economic efficiency, the semiconductor industry keeps looking for use of larger size Si wafers. The next generation wafer is expected to be sized as large as 450 mm in diameter. Many wafering processes including lapping, grinding and polishing have been studied and grinding technology stands out as the most promising process for large-size Si wafer manufacturing. In the current in-feed grinding scheme adopted for Si wafers, the wheel diameter used is generally equal to or larger than the wafer diameter. In turn, larger diameter wheels require larger size machine tools and production lines, which lead to increase in manufacturing costs. In this paper, both experiment and kinematical analysis have been carried out to investigate the feasibility of using small diameter grinding wheels to grind large size Si wafers, mainly focusing on the effects of wheel diameter on wafer geometry and surface roughness. The results show that both wheels generated a central convex profile on the wafer and the small wheel achieved a slightly better flatness than the large wheel. The surface roughness were similar one to another for most area of the wafer except the fringe around its edge. All these experimental results were predicable by the kinematic model established in this paper. Particularly, the kinematic analysis found that the cutting path made by small wheel with diameter equaling to the wafer radius was parallel each other at the fringe around wafer edge, which directly worsened the surface roughness.

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Section: Kinematical Analyses 31 3d Cutting Path and Resultant Wafermentioning

confidence: 99%

“…6, where the initial The rest parameters used for analysis are listed in Table 2. In a coordinate system that the origin is fixed at the center of the wafer, the position of the grain after t seconds [ ( ) ( ) ( )] is described as follows (Zhou, et al, 2003);…”

Section: Kinematical Analyses 31 3d Cutting Path and Resultant Wafermentioning

confidence: 99%

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Ebina

Yoshimatsu

Zhou

et al. 2015

JAMDSM

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“…Such atomic-bit processing in abrasive machining means that the undeformed chip thickness must be at least of the sub-nanometre order. Recently, most ultraprecision grinding systems utilize the infeed method to keep the "constant" area unchanged and thereby to deliver a stable grinding performance in the grinding process [43]. The grinding set-up in this investigation consisted of a vertical grinding spindle and a cup-shaped, metal-bonded tool arranged for planar grinding.…”

Section: Discussionmentioning

confidence: 99%

Planar nanogrinding of a fine grained WC-Co composite for an optical surface finish

Yin

Pickering

Ramesh

et al. 2005

Int J Adv Manuf Technol

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Nanogrinding of a fine-grained WC-Co composite was developed to achieve an optical quality surface without further polishing. Direct planar grinding was conducted with a CNC grinding machine using a metal-bond diamond wheel of grit size of 15 µm, under the nanogrinding conditions selected. The ground planar surfaces were examined using laser and optical interferometry, atomic force microscopy, and scanning electron microscopy to measure flatness, surface roughness, and surface integrity as a function of grinding conditions. Damage-free, planar mirror surfaces with a flatness (peak-to-valley, PV) at the submicron scale and surface roughness < 5 nm R a were obtained.

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“…Usually six DOFs are needed for two types of alignment, including in-plane alignment (by adjustment of x axis, y and theta z) and off-plane alignment (by adjustment of z, theta x and theta y). According to the existing literatures, the error of in-plane alignment has already been less than 10 nm, while the off-plane alignment, which guarantees the uniformity of the imprint force, is still a problem to be resolved [10]- [12].…”

Section: Introductionmentioning

confidence: 99%

Design of an aerostatic imprint head with off-plane alignment functionality for nanoimprint lithography

Chen

et al. 2012

2012 IEEE International Conference on Robotics and Biomimetics (ROBIO)

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Ultra-precision off-plane alignment between the template and the substrate is of great importance to guarantee the quality of patterns manufactured by nanoimprint lithography technology. In this paper, an aerostatic imprint head with off-plane alignment functionality for nanoimprint lithography is developed. The high light of the mechanical design is that the imprint force is transmitted by a spherical aerostatic bearing to the high stiffness frame, thus, bypassing the compliant mechanism, which is employed for high precision off-plane adjustments. This makes the developed device suitable for high load applications while maintaining high alignment precision. The load capacity and stiffness of the imprint device, which are mostly determined by the aerostatic bearing, are studied based on theoretical analysis and experiments. To further increase the stiffness of the device, adjustable magnetic preload is employed. An experiment is performed to study the mechanical characteristics of the imprint head incorporating the magnetic preload structure.

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Three-dimensional kinematical analyses for surface grinding of large scale substrate

Cited by 37 publications

References 1 publication

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Process study on large-size silicon wafer grinding by using a small-diameter wheel

Planar nanogrinding of a fine grained WC-Co composite for an optical surface finish

Design of an aerostatic imprint head with off-plane alignment functionality for nanoimprint lithography

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