“…In the industrial test criteria, most standard life test is carried out at 125°C. Many studies have been made to research the change of solder joint during aging test under different experimental conditions, such as 150°C/1000 h (Wu et al, 2013;Rong et al, 2019), 150°C/500 h (Lee et al, 2013;Zhang et al, 2019b) and 180°C/300 h (Lim et al, 2009). In this study, the samples in Figure 1 Process flow and optical image of the sample four groups were aged at 200°C for 0 h, 100 h, 200 h and 300 h according to cost consideration and industry standard (Wu et al, 2013;Rong et al, 2019;Qi et al, 2008).…”