Three dimensional hybrid microassembly combining robotic microhandling and self-assembly

Sariola, Veikko; Zhou, Quan; Koivo, H.N.

doi:10.1109/robot.2009.5152590

Cited by 15 publications

(4 citation statements)

References 16 publications

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“…For instance, 100 Â 50 mm microchips were flipped and temporarily bonded to the target structure by robotic manipulation and capillary selfalignment -an operation that would otherwise require either dexterous manipulations, complicated kinematics capable of object-centric rotations, or rotating the part by pushing it against an external object. 144…”

Section: Post-processingmentioning

confidence: 99%

Surface tension-driven self-alignment

et al. 2017

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Surface tension-driven self-alignment is a passive and highly-accurate positioning mechanism that can significantly simplify and enhance the construction of advanced microsystems. After years of research, demonstrations and developments, the surface engineering and manufacturing technology enabling capillary self-alignment has achieved a degree of maturity conducive to a successful transfer to industrial practice. In view of this transition, a broad and accessible review of the physics, material science and applications of capillary self-alignment is presented. Statics and dynamics of the self-aligning action of deformed liquid bridges are explained through simple models and experiments, and all fundamental aspects of surface patterning and conditioning, of choice, deposition and confinement of liquids, and of component feeding and interconnection to substrates are illustrated through relevant applications in micro- and nanotechnology. A final outline addresses remaining challenges and additional extensions envisioned to further spread the use and fully exploit the potential of the technique.

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Section: Post-processingmentioning

confidence: 99%

Surface tension-driven self-alignment

et al. 2017

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“…The method is built upon the recent efforts on combining robotic microhandling and self-assembly into a hybrid microassembly strategy [3][4][5][6][7], where fast-speed robotic pick-and-place is used for coarse positioning, and high accuracy is reached by capillary self-alignment of a droplet, driven by the capillary force between the die and the receptor site. The capillary force also aids in overcoming the adhesion forces between the die and the gripper, which is a common problem in micromanipulation.…”

Section: Introductionmentioning

confidence: 99%

Capillary self-alignment assisted hybrid robotic handling for ultra-thin die stacking

Liimatainen

Kharboutly

Rostoucher

et al. 2013

2013 IEEE International Conference on Robotics and Automation

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Abstract-Ultra-thin dies are difficult to package because of their fragility and flexibility. Current ultra-thin die integration technology for 3D microsystems relies on robotic pick-andplace machines and machine vision, which has rather limited throughput for high-accuracy assembly of fragile ultra-thin dies. In this paper, we report a hybrid assembly strategy that consists of robotic pick-and-place using a vacuum microgripper, and droplet self-alignment by capillary force. Ultrathin dies with breakable links are chosen as part of the assembly strategy. Experimental results show that we can align ultra-thin (10µm) dies with sub-micron accuracy without machine vision. A fully automatic sequence of stacking several of these dies is demonstrated. Up to 12 ultra-thin dies have been stacked. These early results show that die-to-die integration of ultra-thin dies with higher throughput than the current industry robot is possible by applying both robotic handling and droplet self-alignment to ultra-thin die assembly.

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“…By careful design, using techniques such as multi-phase self-assembly, relatively complicated microstructures and even 3D microsystem can be implemented [16,17]. Another very promising technology to achieve simultaneous high throughput and high precision is the hybrid microassembly technology [18], which combines selfassembly with traditional robotic pick-and-place technology or other robotic feeding mechanics to construct microsystems flexibly [19][20][21][22]. In those hybrid microassembly studies, a microchip is placed adjacent to the assembly site by a robot at a high speed but with a relatively low precision, and droplets dispensed by a dispenser at the assembly site align the chip at a higher precision.…”

Section: Introductionmentioning

confidence: 99%

Self-alignment in the stacking of microchips with mist-induced water droplets

Chang

Sariola

Jaaskelainen

et al. 2010

J. Micromech. Microeng.

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This paper reports a novel and versatile water droplet self-alignment technique where the water is delivered in mist form onto the assembly site. The droplet forming process has been carefully investigated using machine vision, where each individual droplet on the microchip surface can be identified and the volume per surface area can be calibrated at a specific time. The result reveals that the volume of water droplets on the assembly surface grows linearly as a function of time. Self-alignment based on the mist-induced droplets has been studied, where a robotic microgripper is used to deliver the microchips on the assembly site. The paper also investigates the maximum tolerance of the initial placement error in stacking SU-8 chips 200 × 200 × 70 µm in size, and the possibility of stacking two SU-8 chips of different dimensions using the proposed self-alignment technique. Moreover, self-alignment of chips on hydrophilic/hydrophobic patterns covered by mist-induced water droplets has been studied. The experimental results indicate that this novel self-alignment technique is very promising. Furthermore, a statistical model has been used to validate the experimental results.

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Three dimensional hybrid microassembly combining robotic microhandling and self-assembly

Cited by 15 publications

References 16 publications

Surface tension-driven self-alignment

Surface tension-driven self-alignment

Capillary self-alignment assisted hybrid robotic handling for ultra-thin die stacking

Self-alignment in the stacking of microchips with mist-induced water droplets

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