Three Dimensional Graphene/Copper Dual Networks as Composite Conductors with Enhanced Current Carrying Capacity
Guangmeng Chen,
Weiwei Zhao,
Shifeng Wen
et al.
Abstract:The resolution of electronic devices toward miniaturization and lightweight puts forward requirements for current carrying capacity and density of conductors. Composite conductors consisting of copper as the matrix material and nanocarbon as the filler have aroused great interest, which revealed apparently enhanced ampacity and low density compared to pure Cu. In this study, three-dimensional laser-induced graphene (LIG) was used as the nanocarbon filler to improve the ampacity of Cu by a two-step electrodepos… Show more
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