Three-Dimensional Finite-Difference Method for the Analysis of Microwave-Device Embedding

Christ, Andreas; Hartnagel, H.L.

doi:10.1109/tmtt.1987.1133733

Cited by 110 publications

(52 citation statements)

References 13 publications

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“…EM simulations using custom finite difference in time domain [7], enhanced method of moments [3] and method of line [8] algorithms have been performed. We have developed a new EM model for wire bond and simulated using a commercially available full-wave EM simulator by method of moment (MoM) [13], [14].…”

Section: Electromagnetic and Lumped Element Electrical Modelmentioning

confidence: 99%

“…Experimental [5], [6] and numerical [3], [7], [8] characterization typically neglect the variation in wire bond parameters such as the loop height or assume a particular configuration. In this paper, a comprehensive characterization of wire bond interconnects on air connecting two microstrip lines as a function of lengths, loop heights (tight and loose loops) and bond types (ball-crescent and wedge) is presented.…”

Section: Introductionmentioning

confidence: 99%

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Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Sutono¹,

Cafaro

Laskar

et al. 2001

IEEE Trans. Adv. Packag.

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Abstract-We present the first comprehensive experimental characterization of bond wire interconnects at microwave frequencies which includes a repeatability study, modeling and optimization. Wire bond interconnects with two different bond types (ball-crescent and wedge), two different loop types (tight and loose) and two different lengths (15 and 25 mils), were fabricated and experimentally investigated. We report the performance and repeatability comparison of these configurations and develop an electromagnetic as well as a simple wide band lumped-element equivalent circuit model to 40 GHz. A novel ribbon bond interconnect topology has also been proposed and experimentally tested demonstrating 65% less reflection compared to the conventional bond wire or ribbon configuration.

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Section: Electromagnetic and Lumped Element Electrical Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Sutono¹,

Cafaro

Laskar

et al. 2001

IEEE Trans. Adv. Packag.

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“…At microwave frequencies, integrated circuits and devices using dielectric waveguides require transitions from metallic rectangular waveguides to dielectric waveguides, as well as transitions between different dielectric waveguides and dielectric posts [1][2][3][4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic Waves Scattering at Interfaces Between Dielectric Waveguides: A Review on Analysis and Applications

Garcı́a¹,

Granda²,

Gavela³

et al. 2012

PIER B

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Abstract-The scattering properties of dielectric waveguides connected in cascade can be obtained by using the generalized scattering matrix concept, together with the generalized telegraphist equations formulism and the modal matching technique. This review aims to show the potential of periodic structures in dielectric waveguides in order to gain control of light in the design of microwave and photonic devices. The new inverted Π dielectric waveguide is presented. Numerical and experimental results of the complex scattering coefficients were obtained at microwave frequencies. At optical frequencies, results for planar waveguide photonic crystals are included and compared with the numerical values from commercial software. In all cases the agreement was excellent. Electromagnetic and photonic band gaps, photonic windows, optical switching, optical resonant microcavities as well as refractive index optical sensors can be achieved by means of dielectric waveguides in cascade.

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“…Se considera una guía rectangular con a=2b, parcialmente rellena con un material isótropo de dimensiones a s =0.888b, b s =0.399b, y c=1.4b, centrado en x, x s =(a-a s )/2, y en la cara inferior, y s =0, a la frecuencia normalizada k 0 b=2 ( [99] Figs. 6, 7).…”

Section: Validacionesunclassified

“…Desarrollo teórico [109] Seguidamente, se va a utilizar un resultado del artículo de Christ [99], que es una referencia muy importante en el análisis de guías de onda usando el método de las diferencias finitas en el dominio de la frecuencia. La gran generalidad del método empleado permite analizar esta vez guías inhomogéneas tanto en x como en y, por lo que, para poder reproducir con exactitud los resultados usando métodos modales, se han de emplear tanto modos TE como modos TM, de forma que, en los casos como éste, se usará la formulación indirecta en lugar de la restringida.…”

Section: Hfssunclassified

Modelado con técnicas modales de estructuras de microondas basadas en guías N-furcadas arbitrariamente rellenas con materiales

Portero¹,

Silvino²

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In this work, some modal techniques for solving guided-wave problems have been developed and implemented. Waveguides are very popular in the microwave industry because of their high power handling capability. The modal analysis of the fields in guided-wave structures permits to decompose a complex device in several simpler elements, which can be analyzed by the best suited method. Basically, modal techniques can be divided among those which analyze waveguide junctions and those which analyze the propagation characteristics of a given waveguide. Then, the application of the generalized circuital theory permits to join those structures properly. An analysis of the bibliography in this subject has been performed. The techniques that have been considered to be best suited for each problema have been implementated, and they have been generalized to N-furcated junctions, which are an extension of the bifurcated waveguides. In those cases where the geometry does not allow an analytic treatment, an hybrid technique finite element/modal analysis has been used. With the aid of these tools, some microwave devides have been designed and their performance has been validated with the aid of commercial simulators.Some guidelines for future work in the matter have been proposed.Modelado con técnicas modales de estructuras de microondas basadas en guías N-furcadas arbitrariamente rellenas con materiales AGRADECIMIENTOSEste trabajo es el resultado de una serie de investigaciones realizadas en el Grupo de Calentamiento por Microondas de la Universidad Politécnica de Valencia, liderado por José Manuel Catalá, mi director. A él debo la especialización que he adquirido en el campo de las microondas y el sustento económico que me ha permitido cursar en exclusividad mis estudios de doctorado. Espero que su lucha constante contra mi tendencia natural al desorden se haya visto reflejada en este documento. Aquí consta mi agradecimiento por todo su apoyo. También quiero expresar mi agradecimiento a Felipe Peñaranda, por su implicación en el desarrollo matemático de algunos métodos y en la obtención de resultados.Mis compañeras, las recientes madres, que han llegado conmigo hasta el final, han hecho que el trabajo fuera mucho más llevadero, aparte de darme su apoyo, cuando no ayuda directa, en incontables momentos: Bea, que conoce más que nadie mi vida en la universidad en estos diez años, y Rocío, mi amiga colombiana, que cuando todos nos estabilicemos, me animará a visitar el otro lado del charco.Esta tesis debe mucho a Miguel Ángel Solano, de la Universidad de Cantabria. Cuando la cosa no estaba nada clara, di con él, y no dudó en ayudarme en mi trabajo e implicarse, incluso en los detalles. De aquellas interesantes comunicaciones, surgió la idea de dar un nuevo rumbo a la investigación, cuyos frutos se consiguieron finalmente.Mis padres tienen mucha culpa de que haya llegado a completar mi formación hasta el máximo nivel, puesto que siempre han querido que así sea, para lo que me han mantenido y eximido de otras tareas más allá...

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Three-Dimensional Finite-Difference Method for the Analysis of Microwave-Device Embedding

Cited by 110 publications

References 13 publications

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Electromagnetic Waves Scattering at Interfaces Between Dielectric Waveguides: A Review on Analysis and Applications

Modelado con técnicas modales de estructuras de microondas basadas en guías N-furcadas arbitrariamente rellenas con materiales

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