2021
DOI: 10.1038/s41586-021-03847-y
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Three-dimensional electronic microfliers inspired by wind-dispersed seeds

Abstract: Advances in Large Language Models (LLMs) have inspired a surge of research exploring their expansion into the visual domain. While recent models exhibit promise in generating abstract captions for images and conducting natural conversations, their performance on textrich images leaves room for improvement. In this paper, we propose the Contrastive Reading Model (Cream), a novel neural architecture designed to enhance the language-image understanding capability of LLMs by capturing intricate details typically o… Show more

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Cited by 126 publications
(93 citation statements)
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“…[ 68,69 ] Notably, 3D flexible electronics maintain conductivity while gaining an extra dimension and thus more sophisticated functions that 2D electronics do not offer (Figure 3E,F). [ 70–72 ]…”
Section: Materials and Structuresmentioning
confidence: 99%
“…[ 68,69 ] Notably, 3D flexible electronics maintain conductivity while gaining an extra dimension and thus more sophisticated functions that 2D electronics do not offer (Figure 3E,F). [ 70–72 ]…”
Section: Materials and Structuresmentioning
confidence: 99%
“…The use of this technique in creating functional 3D structures has expanded in recent years. [ 76–78 ] Successful demonstrations of directed 3D assembly have been applied to many applications, including electronics/optoelectronics with unconventional form factors, [ 25,79 ] microelectromechanical systems, [ 80 ] energy harvesters, [ 81 ] cell scaffolds, [ 76,82,83 ] multifunctional interfaces to organoids, [ 84 ] electronic microfliers, [ 85 ] microfluidic networks, [ 78 ] and many others.…”
Section: Directed 4d Assembly By Compressive Bucklingmentioning
confidence: 99%
“…Recently, atmospheric sensors with 3D shapes inspired by wind‐dispersed seeds have been assembled by mechanically guided assembly (Figure 10c(i)). [ 72 ] A colorimetric pH sensor is obtained using a pH‐responsive membrane as the substrate (Figure 10c(ii)). The electronic and optoelectronic components are incorporated for signal communication (Figure 10c(iii)).…”
Section: Stress‐induced Assemblymentioning
confidence: 99%