Three-Dimensional Digital Image Correlation Based on Speckle Pattern Projection for Non-Invasive Vibrational Analysis

Janeiro, Alvaro Souto; Fernández-López, Antonio; Manguán, M. Chimeno; Pérez-Merino, Pablo

doi:10.3390/s22249766

Cited by 7 publications

(1 citation statement)

References 62 publications

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“…Other applications were developed by calculating the strain in friction stir-weld samples, in which samples were submitted to uniaxial tensile loads, and the strain evaluation by means of sub-pixel DIC was performed [15]. Recent advances in DIC set the importance of strain measurements within the bond line of an adhesive [16]; to evaluate acceleration, displacements, strain, and strain rate during impact tests [17], to determine the damage and deformation characteristics of rock-like samples [18]; to monitor the Great Belt Bridge [19]; to measure local displacement in hybrid joints [20]; to characterize the structural dynamics of a composite material [21]; and to determine the stress-strain properties of wood samples subjected to tensile tests [22].…”

Section: Introductionmentioning

confidence: 99%

Optical Analysis of the Impact Transmission in Steel Sheet Arrays with Bolted-Type Joints

Martínez-Calzada,

Tapia-Pérez,

Rodríguez-Torres

et al. 2023

Applied Sciences

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This research leads with the analysis of a structural joint. Different arrays of steel sheets were joined using bolts. The structures were built in a metallic box filled with Granitic 0/3 sand. This box was used as a rigid body to transmit impacts and the sand as a medium to interact between the body and the structure. Then, an optical set-up was placed to measure the interaction of the impact along the different arrays. Measurements were made 5 cm before and 5 cm after the bolt. Results were analyzed by performing signal filtering and approaching a mathematical solution revealing that impact interaction can be harmonic or damped oscillations with more than 98% accuracy.

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Section: Introductionmentioning

confidence: 99%

Optical Analysis of the Impact Transmission in Steel Sheet Arrays with Bolted-Type Joints

Martínez-Calzada,

Tapia-Pérez,

Rodríguez-Torres

et al. 2023

Applied Sciences

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Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation

Gao,

Chen,

et al. 2024

Microsyst Nanoeng

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The projected speckle-based three-dimensional digital image correlation method (3D-DIC) is being increasingly used in the reliability measurement of microelectronic packaging structures because of its noninvasive nature, high precision, and low cost. However, during the measurement of the thermal reliability of packaging structures, the thermal airflow generated by heating introduces distortions in the images captured by the DIC measurement system, impacting the accuracy and reliability of noncontact measurements. To address this challenge, a thermal airflow distortion correction model based on the transformer attention mechanism is proposed specifically for the measurement of thermal warpage in microelectronic packaging structures. This model avoids the oversmoothing issue associated with convolutional neural networks and the lack of physical constraints in generative adversarial networks, ensuring the precision of grayscale gradient changes in speckle patterns and minimizing adverse effects on DIC calculation accuracy. By inputting the distorted images captured by the DIC measurement system into the network, corrected images are obtained for 3D-DIC calculations, thus allowing the thermal warpage measurement results of the sample to be acquired. Through experiments measuring topography with customized step block specimens, the effectiveness of the proposed method in improving warpage measurement accuracy is confirmed; this is particularly true when captured images are affected by thermal airflow at 140 °C and 160 °C, temperatures commonly encountered in thermal reliability testing of packaging structures. The method successfully reduces the standard deviation from 9.829 to 5.943 µm and from 12.318 to 6.418 µm, respectively. The results demonstrate the substantial practical value of this method for measuring thermal warpage in microelectronic packaging structures.

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Optimized super-resolution promote accuracy for projection speckle three-dimensional digital image correlation

Gao

Xiong

Lei

et al. 2023

Meas. Sci. Technol.

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The camera resolution and electronic noise limit the accuracy of the projection speckle three-dimensional digital image correlation (3D-DIC) which is a non-invasive method to detect the reliability of electronic packaging structure. In this study, a measurement method of super-resolution (SR) reconstruction coupled with projection speckle DIC is proposed. The algorithm based on the maximum a posteriori (MAP) model for DIC measurement systems was also optimized, and a speckle-specific bimodal prior was proposed to adapt to speckle images. By using optimized SR technology as an image pre-processing technique to enhance the resolution of captured images, the accuracy of measurements is improved. Full-field displacement measurement experiments show that, with suitable magnification and speckle size, the use of SR technology reduces the range of displacement errors from 8 μm to 2 μm. Experiments on step block topography measurements show that the use of SR technology reduces the error between DIC measurements and Moiré interferometry from 5 μm to within 2 μm. Therefore, SR technology can be effectively paired with projection speckle DIC measurements to adapt to various measurement scenarios in the field of electronic packaging reliability testing.

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Three-Dimensional Digital Image Correlation Based on Speckle Pattern Projection for Non-Invasive Vibrational Analysis

Cited by 7 publications

References 62 publications

Optical Analysis of the Impact Transmission in Steel Sheet Arrays with Bolted-Type Joints

Optical Analysis of the Impact Transmission in Steel Sheet Arrays with Bolted-Type Joints

Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation

Optimized super-resolution promote accuracy for projection speckle three-dimensional digital image correlation

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