Three-Dimensional Binocular Range Sensor Large Scale Integration with a 410 µs/Frame Output Time High-Speed Data Output Method

Abstract

We developed a three-dimensional (3D) binocular range sensor LSI equipped with a high-speed data output circuit. The circuit outputs only the information of the position corresponding to the detected object. As a result, the output time was reduced and the frame rate improved. The chip was produced using a process of 0.35 µm complementary metal oxide semiconductor (CMOS) 1-poly 3-metal and has a die size of 4.20×3.33 mm2. The chip uses a 3.0 V supply voltage and has a power consumption of 405 mW at a clock frequency of 10 MHz. The correlation of the image sensor's output takes 32 µs/frame and the maximum output time is 410 µs/frame. Because the output time is shorter enough than typical exposure, the frame rate is practically not limited by the data output time.

Binocular range-sensor LSI with improved distance detection precision by coordinated pixel placement

“…We previously developed binocular range-sensor LSIs that solve the above problems [9,10,11]. We realized a small low-cost obstacle recognition system by integrating two image sensors and all the processing circuits on a single chip.…”

Sensor assembly method using silicon interposer with trenches for three-dimensional binocular range sensors

“…Details of these circuit configurations can be obtained from our reports on the previously developed single-chip 3D range sensors. 28,29) The LSI is fabricated by a 0.35 µm CMOS single polysilicon four-metal process and the chip size is 8. As shown in Fig.…”

“…[16][17][18][19][20][21][22][23][24][25][26] We previously developed single-chip 3D binocular range sensors by integrating two image sensors and a parallax calculation circuit. [27][28][29][30] However, the distance between the two sensors was 2 mm, and it was necessary to use the binocular optical lens shown in Fig. 1.…”

Sensor assembly method using Si-interposer with trenches for 3-D binocular range sensors

“…We developed single-chip 3-D binocular range sensors by integrating two image sensors and a parallax calculation circuit [4] [5]. However, the distance between the two sensors is 2 mm, and it is necessary to use the binocular optical lens shown in Figure 1.…”