Abstract:After temporary bonding and thinning process, many backside processes will be conducted on the thinned wafer. The critical processes for thin wafer handling material are high temperature and high vacuum processes. In this article, a quick adhesive selecting method is proposed. Backside process of PECVD SiO 2 is identified as the most critical process for thin wafer handling material selection. Two thermal plastic thin wafer handling materials are used in this study for 300 mm wafers and thermal compress bondin… Show more
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