Handbook of Surfaces and Interfaces of Materials 2001
DOI: 10.1016/b978-012513910-6/50055-4
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THIN Ta2O5 LAYERS ON Si AS AN ALTERNATIVE TO SiO2 FOR HIGH-DENSITY DRAM APPLICATIONS

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Cited by 43 publications
(53 citation statements)
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“…4, confirms that the influence of T s is essential in the range 300-350°C, where n arises with 0.12, achieving the value of 1.98, similar to values reported for as-fabricated Ta 2 O 5 films obtained by other methods. 6,7,16,27 Further, the highest T s does not lead to any increase of refractive index at 633 nm. Obviously, the dense enough as-grown oxides can be achieved at T s = 350-400°C.…”
Section: B Xrd Resultsmentioning
confidence: 92%
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“…4, confirms that the influence of T s is essential in the range 300-350°C, where n arises with 0.12, achieving the value of 1.98, similar to values reported for as-fabricated Ta 2 O 5 films obtained by other methods. 6,7,16,27 Further, the highest T s does not lead to any increase of refractive index at 633 nm. Obviously, the dense enough as-grown oxides can be achieved at T s = 350-400°C.…”
Section: B Xrd Resultsmentioning
confidence: 92%
“…Since R is a periodical function of nd with a periodicity of / 2, it changes with variation of nd from zero to / 4, and depends on the ratio between refractive index n of the layer and of the substrate, n sub , respectively, ͑R decreases when n / n sub Ͻ 1 and vice versa͒. If we suppose that the values of n are close to 2-2.2, which are the typical values of stoichiometric Ta 2 O 5 , 7,16,25 the optical thickness will vary from /8 to / 18 in the whole spectral range and it will be generally smaller than / 4. Considering that n / n sub Ͻ 1, ͑n sub = 5.60-3.66 in the used spectral range for Si wafer͒, the decay of R could be attributed to the increase of optical thickness.…”
Section: B Xrd Resultsmentioning
confidence: 99%
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“…Between the high-dielectrics tantalum pentoxide (Ta 2 O 5 ) [7] has been identified as very good solution for dynamic random access memories (DRAM) [8]. In this work we specifically study the case of Ta 2 O 5 .…”
Section: Introductionmentioning
confidence: 99%
“…After chemical cleaning, a Ta film was deposited on Si by sputtering of a Ta target in Ar atmosphere. Subsequently, the Ta film was oxidized in dry O 2 at 600 ∘ C. More details on the sample preparation can be found in [8]. The above oxidation temperature was chosen so as to be low enough to minimize the substrate oxidation in order to prevent the formation of tantalum silicides.…”
Section: Fabrication Of the Samplesmentioning
confidence: 99%