Thin single layer materials for device application

Cooke, Mary; Allwood, D. A.; Atkinson, D.; Xiong, Gang; Faulkner, Colm C.; Cowburn, R. P.

doi:10.1016/s0304-8853(02)01280-5

Cited by 11 publications

(4 citation statements)

References 19 publications

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“…As is well known the effect of substrate roughness affects the quality of a device [28]. Measurements of the surface showed that the paper had a roughness of 15-20 nm in comparison to that found on silicon of 1-2 nm or glass of 5 nm.…”

Section: Resultsmentioning

confidence: 93%

Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications

Cooke

Wood

2015

J. Micromech. Microeng.

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Use policyThe full-text may be used and/or reproduced, and given to third parties in any format or medium, without prior permission or charge, for personal research or study, educational, or not-for-prot purposes provided that:• a full bibliographic reference is made to the original source • a link is made to the metadata record in DRO • the full-text is not changed in any way The full-text must not be sold in any format or medium without the formal permission of the copyright holders.Please consult the full DRO policy for further details. Using commercial standard paper as a substrate has a significant cost reduction implication over other more expensive substrate materials by approximately a factor of 100 [1][2]. Discussed here is a novel process which allows photolithography and etching of simple metal films deposited on paper substrates, but requires no additional facilities to achieve it. This allows a significant reduction in feature size down to the micron scale over devices made using more conventional printing solutions which are of the order of tens of microns. The technique has great potential for making cheap disposable devices with additional functionality, which could include flexibility and foldability, simple disposability, porosity and low weight requirements. The potential for commercial applications and scale up is also discussed. Keywords: Paper, Flexible, Photolithography, Microelectronics IntroductionSilicon has long been the industrial standard substrate for devices made using photolithographic processing. It is only in recent years that more flexible substrates have become commercially interesting [3][4]. This is partially due to their potential to be used within the printing industry, as well as the possibility of developing flexible devices. Typical flexible films tend to be polymer based and have specialist coatings on the surface to allow the material to remain stable when being subjected to temperature and humidity changes [5][6].To date, electronics work on paper substrates has tended to be limited to using a variety of printing techniques [7][8]. While these are ideal for roll to roll processes [9], there is a limitation on feature size which is achievable using printing; this limit is 20-40 microns [10]. Similarly a significant amount of device fabrication on paper tends to use a barrier layer on the surface to ensure the printed inks do not permeate into the cellulose matrix of the material [11].There are many different types of papers available, each with their own unique properties [1,2,12]. Some of these can be found to be more suited to metal deposition than others. To date though, most electronics applications on paper use printing [13][14], with a few using a shadow mask technique or stencil [15][16].Electrical measurements show that the conductivity of a feature on paper, when compared to the same feature on silicon, can vary depending on paper type as well as by the deposition technique, for both thin film and ink-jet printed devices 2 can vary depending on paper type as ...

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Section: Resultsmentioning

confidence: 93%

Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications

Cooke

Wood

2015

J. Micromech. Microeng.

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“…Figure 3b shows a series of time-resolved XMCD-PEEM images of a chain from the optimal region taken at delay times between 1 and 4 ns. Surface roughness and other lithographical irregularities may contribute to errors in this system 8,30,31,32 while random signal propagation errors from individual clocking cycles are averaged into each image. This leads to contrast "graying" from individual nanomagnets that do not reproducibly reorient in the same direction each cycle.…”

Section: Main Textmentioning

confidence: 99%

Sub-nanosecond signal propagation in anisotropy-engineered nanomagnetic logic chains

Nowakowski

Carlton

et al. 2015

Nat Commun

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Energy efficient nanomagnetic logic (NML) computing architectures propagate binary information by relying on dipolar field coupling to reorient closely spaced nanoscale magnets. Signal propagation in nanomagnet chains has been previously characterized by static magnetic imaging experiments; however, the mechanisms that determine the final state and their reproducibility over millions of cycles in high-speed operation have yet to be experimentally investigated. Here we present a study of NML operation in a high-speed regime. We perform direct imaging of digital signal propagation in permalloy nanomagnet chains with varying degrees of shape-engineered biaxial anisotropy using full-field magnetic X-ray transmission microscopy and time-resolved photoemission electron microscopy after applying nanosecond magnetic field pulses. An intrinsic switching time of 100 ps per magnet is observed. These experiments, and accompanying macrospin and micromagnetic simulations, reveal the underlying physics of NML architectures repetitively operated on nanosecond timescales and identify relevant engineering parameters to optimize performance and reliability.

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“…The electron current was optimized by biasing the electron filament's housing and the filament to give a maximum electron current of 25 mA at the centre of the ionization chamber, through which the atom flux of the material to be ionized was greatest (in this case either aluminium or permalloy). An atom flux was produced by either resistance heating of an appropriate crucible [12] or hotcathode evaporation from a filament. Thickness calibration of an evaporated sample showed that the atom flux was greater than 10 12 atoms s −1 and it was found that some of the atoms were ionized by electron ionization, producing an ion current at the ion detection plate.…”

Section: Electron Ionizationmentioning

confidence: 99%

Comparison of simple low-energy ion sources for direct deposition of submicron structures

Cooke¹,

Atkinson

Hibbert

et al. 2003

Nanotechnology

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Examination was made of the optimum performance of thermal ionization, field ionization and electron ionization sources, using permalloy (Ni 81 Fe 19 ) and aluminium as source materials. Discussion is made of the possible use of these to give direct deposition sources, for low-cost nanoscale device production. Fabrication of field emitter tips using focused ion beam milling was used to try to enhance the ion emission current of field ionization sources. Electron ionization produced the largest ion current, but field ionization gave enhanced stability.

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Thin single layer materials for device application

Cited by 11 publications

References 19 publications

Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications

Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications

Sub-nanosecond signal propagation in anisotropy-engineered nanomagnetic logic chains

Comparison of simple low-energy ion sources for direct deposition of submicron structures

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