Abstract:Cobalt is gaining a strong attention as an alternative metal for very narrow interconnects of advanced LSIs. Cobalt interconnects are fabricated by a damascene process like in copper. Slurries for the chemical mechanical polishing contain both an oxidizer and a corrosion inhibitor, in addition to abrasives. To understand the chemistry of the cobalt surface exposed to slurries, we studied the development of a layer on cobalt surfaces in benzotriazole (BTA)–hydrogen peroxide (H2O2) aqueous solutions using in sit… Show more
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