Thin Films Ablation by Induced Forward Transfer Technique

Abstract

Laser-Induced Forward Transfer (LIFT) is a technique which enables the controlled transfer of a thin film material from a transparent carrier (donor) to a receiver substrate (acceptor). The receiver substrate is usually placed in parallel and close to the thin film source under air or vacuum conditions. In this work microdeposition of gold (Au) and Copper (Cu) thin films were deposited on glass substrate by Pulsed Laser Deposition (PLD). These thin films were irradiated by a single pulse and transferred to a silver (Ag) and silicon (Si) receiver substrates. The laser source used for this study was a Nd-YAG Q-Switching second harmonic generation (SHG) Pulsed Laser with a wavelength 532nm, repetition rate 1-6 Hz ,and pulse duration 10ns. Deposited size, morphology and adhesion to the receiver substrate as a function of applied laser fluence are investigated.