or it may be attributed to a contribution of dissociative adsorption of N2 ~ ions IN2 + + e ~ 2N(17)] to the deposition of nitrogen atoms, notably at low frequencies. The influence of total pressure on the Si/N ratio (Fig. 4) can be explained by a reduction in ion energy with increasing total pressure (as discussed before). This leads to higher Si/N ratios at the lower ion energies (higher pressures).According to Fig. 7, the Si/N ratio of the deposited layers determines, in a first approximation, the way in which hydrogen is bonded. At high Si/N ratios (St-rich layers), almost all the hydrogen is bonded to silicon. At Si/N ratios below 0.75, most of the hydrogen is bonded to nitrogen.
ConclusionsThe composition and density of plasma silicon-nitride layers can be adjusted within certain "limits by variation of the deposition temperature, total pressure, gasphase composition, and RF frequency. A simplified model is proposed for the deposition kinetics of plasma siliconnitride. It is concluded that the deposition rate is determined by the insertion of silicon and nitrogen containing compounds into Si-H and N-H bonds at the surface of the growing layer. The deposition rate is almost independent of total pressure and deposition temperature. After insertion of the formed radicals into Si-H or N-H bonds, hydrogen elimination takes place by cross-linking. It is concluded that the hydrogen-elimination step can be influenced by temperature and by ion bombardment.Layers deposited at high temperatures (>550~ or at high frequencies (>4 MHz) show a tensile stress behavior. This is explained by a hydrogen desorption rate which is smaller than the rate-limiting step for deposition. After deposition of silicon and nitrogen containing radicals, hydrogen desorption continues for a while, leading to a layer which shrinks at the deposition temperature and consequently to a tensile stress behavior. Layers deposited at low temperatures (<550~ at low frequencies (<4 MHz) show a compressive stress. Due to ion bombardment, atoms are implanted and bonds are broken, leading to a disturbed short-range orcler of the Si-N structure and to an expansion of the plasma nltride layer.ABSTRACT Electrical properties, structure, and phase morphology of gold-gallium alloy films codeposited on {100} substrates of gallium arsenide have been investigated by measurement of Schottky barrier height ~b and breakdown voltage Vb as a function of film composition and annealing conditions and comparison with corresponding structure and phase morphology, as determined by x-ray diffraction and transmission electron microscopy. Both 4~ and Vb decrease with increasing composition of gallium in the codeposited films and with increasing severity of annealing conditions. These decreases are attributed to formation of gold-gallium phases, either directly through codeposition of alloy films or through annealing of pure gold films on substrates of gallium arsenide, and localized current or field concentrations due to nonplanar phase morphologies. General behavior of electr...