The epitaxial lift-off (ELO) process is utilized to produce thin-film III-V devices, while the substrate (GaAs wafer) on which the III-V structure was grown can be reused. However, so far the direct reuse of these GaAs wafers is inhibited by the remnants on the wafer surface that cannot be removed in a straightforward fashion utilizing general cleaning methods. Therefore, etching of GaAs wafers in hydrofluoric acid was investigated by microscopic techniques, profilometry and X-ray photoelectron spectroscopy. It was found that immediately after etching the wafer surface is covered by a brown layer of elemental arsenic. The thickness and uniformity of this layer depend on both illumination during etching and the HF concentration. During storage of the etched wafer the As layer is replaced by As 2 O 3 particles. It is shown that oxide particles form only when the wafer is exposed to light in the presence of air. A model that explains the As formation and the subsequent particle formation is given. © 2012 The Electrochemical Society. [DOI: 10.1149/2.006303jss] All rights reserved. III-V solar cell technology is important in space and concentrated photovoltaic (CPV) applications.1 From a fundamental point of view III-V semiconductors are ideal for solar cell applications. A large range of III-V materials are direct semiconductors allowing for thinfilm cell structures, and III-V compounds can easily be combined into multi-junction cells yielding record efficiencies.2 Present commercially available triple-junction cells for CPV systems reach efficiencies as high as 38%, while current research is aiming to demonstrate efficiencies above 50%.A major disadvantage in the production of high-efficiency III-V solar cells is that they require an expensive single-crystalline GaAs or Ge wafer as a template. After deposition of the solar cell structure the wafer is of no further use for its performance. Nevertheless, using the present fabrication techniques the active thin-film structure including the passive wafer are processed together to a thick solar cell. In order to avoid wasting the substrate, our research group has perfected an epitaxial lift-off (ELO) technique to separate thin-film solar cells from their wafer and transfer them to an inexpensive carrier. The ELO process involves the selective etching of an intermediate AlAs release layer, resulting in thin film cell structures and thus allowing reuse of the wafer. Over the years this research has yielded significant increases in etch rate, 3,4 an increase in sample size up to 4 inch wafers, 4-6 thin-film GaAs cells with record efficiencies (26.1%), 7 and the demonstration of its potential for space applications. 8 In recent years the importance of the ELO technology for PV applications has received wide-spread attention, resulting in further increase of the thin-film GaAs cell efficiency to 28.3% 9 and industrial interest for genuine thin-film cell production.
10-14The aim of ELO is to allow the reuse of the wafer for the production of a large number of thin-film cells ...