Thin-film edge electrode lithography enabling low-cost collective transfer of nanopatterns

Abstract

This paper reports a new lithography method using thin-film edge electrodes (TEEs) to collectively transfer nanopatterns by generating oxide on the substrate surface via an electrochemical reaction (ECR). Nanometric thick TEEs are formed on the sidewall of insulating stamping structures. ECR-based oxide patterns have the same width and shape as the TEEs because ECR is induced only between the conductor and the substrate. Oxide nanopatterns of 300 nm and 70 nm in width were collectively transferred on Si substrate in a millimeter-scale area.978-1-4799-7955-4/15/$31.00 ©2015 IEEE