Abstract:When a ferrite substrate is used to prepare thin-film InSb Hall element chips, one surface of the ferrite wafer needs to be polished. The traditional chemical mechanical polishing (CMP) method, often used for polishing of ferrite wafers, has several problems: a long time to install and remove wafers, a little high debris rate, and high cost. Taking advantage of the fact that ferrite wafers can be magnetically attracted, a method using independent RuFeB magnets to attract and hold ferrite wafers is proposed. Th… Show more
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