Thin Copper Plate Defect Detection Based on Lamb Wave Generated by Pulsed Laser in Combination with Laser Heterodyne Interference Technique

Abstract

Thin copper plate is widely used in architecture, transportation, heavy equipment, and integrated circuit substrates due to its unique properties. However, it is challenging to identify surface defects in copper strips arising from various manufacturing stages without direct contact. A laser ultrasonic inspection system was developed based on the Lamb wave (LW) produced by a laser pulse. An all-fiber laser heterodyne interferometer is applied for measuring the ultrasonic signal in combination with an automatic scanning system, which makes the system flexible and compact. A 3-D model simulation of an H62 brass specimen was carried out to determine the LW spatial-temporal wavefield by using the COMSOL Multiphysics software. The characteristics of the ultrasonic wavefield were extracted through continuous wavelet transform analysis. This demonstrates that the A0 mode could be used in defect detection due to its slow speed and vibrational direction. Furthermore, an ultrasonic wave at the center frequency of 370 kHz with maximum energy is suitable for defect detection. In the experiment, the size and location of the defect are determined by the time difference of the transmitted wave and reflected wave, respectively. The relative error of the defect position is 0.14% by averaging six different receiving spots. The width of the defect is linear to the time difference of the transmitted wave. The goodness of fit can reach 0.989, and it is in good agreement with the simulated one. The experimental error is less than 0.395 mm for a 5 mm width of defect. Therefore, this validates that the technique can be potentially utilized in the remote defect detection of thin copper plates.