Thickness-dependent thermal reliability of low-dielectric constant polycrystalline PTFE submicron dielectric thin films

Thermally stabilized bismaleimide–triazine resin composites for 10-GHz level high-frequency application

“…1 –4 This technology requires dielectric materials with low dielectric constant and dielectric loss because of the inverse relationship between the square root of the dielectric constant and the propagation delay of electronic signals. 5 In general, high-performance dielectric materials, such as cyanate ester (CE), 6 –10 bismaleimide–triazine (BT) resin, 11 –15 polytetrafluoroethylene resin, 16 and bismaleimide (BMI), 17,18 have been increasingly used in the field. Among these dielectric materials, BT resins display superior performance.…”

Preparation of a low dielectric POSS/epoxy hybrid polymer without sacrificing the mechanical performance

“…1–3 However, its high dielectric constant ( D k ) and dielectric loss ( D f ) severely restrict its potential applications in fifth-generation (5G) technologies, which usually requires materials with low D k to avoid signal transmission delays and crosstalk issues. 4,5…”

“…[1][2][3] However, its high dielectric constant (D k ) and dielectric loss (D f ) severely restrict its potential applications in fifth-generation (5G) technologies, which usually requires materials with low D k to avoid signal transmission delays and crosstalk issues. 4,5 Theoretically, the D k and D f of the epoxy polymers can be lowered via the reduction of polarizability and the number of dipoles per unit volume. 6,7 The effective strategies are (i) polymers or inorganic materials with low polarity, including polyphenyl ether, silicon dioxide, boron nitride and glass fiber, are used as fillers.…”