Thickness dependence of morphology and mechanical properties of on-wafer low-k PTFE dielectric films

Wang, Jinguo; Kim, H.K; Shi, Frank G.; Zhao, Bin; Nieh, T.G.

doi:10.1016/s0040-6090(00)01434-6

Cited by 24 publications

(6 citation statements)

References 23 publications

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“…They recently proved capable to detect the effect of porosity [19], resolve the impact of interface adhesion, thickness and influence of layered architecture on mechanical parameters of ultra-thin low-k films [20][21][22], and clarify the mechanical stability of mesoporous structures [23]. Interestingly, using this technique, Liou and Pretzer [24] evaluated thermal stresses, thermal expansion and concluded on bond-conversion from Si-H to Si-O in hydrogen silsesquioxane low-k films due to variations of curing temperature, while thorough study of indentation fracture by Volinsky et al [25] led to the new criterion of spontaneous cracking of low-k films.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of carbon-doped low-k multilayer structure by nanoindentation

Fujikane

Nagao²,

Liu³

et al. 2008

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Evaluation of carbon-doped low-k multilayer structure by nanoindentation

Fujikane

Nagao²,

Liu³

et al. 2008

Journal of Alloys and Compounds

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“…Therefore, new materials need to be developed for CCLs in high‐frequency applications. So far, the research objects mainly include the modified epoxy resin, cyanate ester (CE), 7,8 polyimide (PI), 9,10 polytetrafluoroethylene (PTFE), 11,12 polyphenylene oxide (PPO) 13,14 and other hydrocarbon resins 15–17 . Among these materials, CE and PI show better dielectric and thermal properties, but higher dielectric loss.…”

Section: Introductionmentioning

confidence: 99%

Thermosetting epoxidized polybutadiene/low‐molecular weight polyphenylene oxide compatible system with quite low‐dielectric constant and loss prepared through co‐curing reaction

Dai

Jiang

et al. 2022

Polymers for Advanced Techs

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Through the redistribution reaction of PPO, the hydroxyl‐terminated low molecular weight PPO (PPO‐OH) was prepared. Furthermore, after the reacting of PPO‐OH with methacrylic anhydride, the double‐bond‐terminated low‐molecular weight PPO (R‐PPO) were synthesized, its Mn was 2631 g/mol. The R‐PPO were co‐cured with epoxidized polybutadiene (JP‐100) to prepare JP‐100/R‐PPO cured systems. The JP‐100/R‐PPO cured systems showed single‐phase morphology. The co‐curing reaction with R‐PPO could effectively improve the thermal performance of JP‐100, the glass transition temperature (Tg) of cured JP‐100/R‐PPO systems raised greatly. For the cured JP‐100/R‐PPO (100/30) system, its Tg was 192°C. The dielectric constant and dissipation factor of cured JP‐100/R‐PPO systems were both decreased and showed good frequency stability. The dielectric constant and dissipation factor at 1 MHz of cured JP‐100/R‐PPO (100/30) system were 2.61 and 0.0038, respectively, were obviously lower than those of cured JP‐100 system (which were 3.10 and 0.0099, respectively). The JP‐100/R‐PPO systems exhibited an excellent thermal stability. The 5% weight loss temperature (T5%) of cured JP‐100/R‐PPO system was around 340°C.

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“…The influence of compounds affects the nucleation and growth process of polymer crystals [9,10]. In addition to the common spherical and banded crystals of PTFE, fibrous crystals, shish-kebab crystals, and dendrites can be obtained with filler, extra field, or preparation processes [13][14][15][16][17][18][19]. With those, the crystal morphology and microstructure of the PTFE matrix can be tailored, and then, its properties, including thermal conductivity, dielectric loss, mechanical strength, and so on, are also affected [20][21][22][23][24].…”

Section: Introductionmentioning

confidence: 99%

PTFE Crystal Growth in Composites: A Phase-Field Model Simulation Study

Fan

et al. 2022

Materials

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We investigated, via a phase-field model simulation, the effects of a matrix’s properties and a filler’s characters on the polytetrafluoroethylene (PTFE) crystal growth process in composites under various supercooling degrees. The results show that the supercooling degree has a deciding influence on the crystal growth process. The intrinsic properties of PTFE polymer, such as anisotropic strength and phase transition latent heat, affect the growth rate, orientation, and interfacial integrity of the crystal trunk and the branching of the PTFE crystal growth process. The factors of the PTFE crystallization process, such as anisotropic strength and phase translation interface thickness, affect the uniformity and crystallization degree of the PTFE crystal. In the composites, the biphasic interface induces the crystal growth direction via the polymer chain segment migration rate, of which the degree depends on the shapes of the filler and the PTFE crystal nucleus. According to the results, choosing the low molecular weight PTFE and mixture filler with various particle sizes and surface curvatures as the raw materials of PTFE-based composites improves the crystallization of the PTFE matrix.

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Thickness dependence of morphology and mechanical properties of on-wafer low-k PTFE dielectric films

Cited by 24 publications

References 23 publications

Evaluation of carbon-doped low-k multilayer structure by nanoindentation

Evaluation of carbon-doped low-k multilayer structure by nanoindentation

Thermosetting epoxidized polybutadiene/low‐molecular weight polyphenylene oxide compatible system with quite low‐dielectric constant and loss prepared through co‐curing reaction

PTFE Crystal Growth in Composites: A Phase-Field Model Simulation Study

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