Abstract:Copper is the most widely used materials for microelectronics applications due to their electrical and thermal conduction properties, and in several appplications, thick and porous layers are requested.
Different possibilities still exists such as copper-zinc or copper-manganese electrodeposition followed by an anodic dissolution, but the faster and simpler way resides in electroforming deposition made by Dynamic Hydrogen Bubble Template (DHBT) [1]. This process works in unusual potentials and c… Show more
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