Thermotunnel refrigerator with vacuum/insulator tunnel barrier: A theoretical analysis

Tavkhelidze, A.; Svanidze, Vasiko; Tsakadze, L. M.

doi:10.1116/1.2803717

Cited by 13 publications

(18 citation statements)

References 4 publications

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“…However, the cooling coefficient of such junctions does not exceed 10%. Further, a metal-vacuum-insulatormetal (MVIM) tunnel junction with an additional thin insulator coating layer has been studied [6]. It was found that the cooling coefficient of MVIM junction is of the order of 40-50% and, in addition, the insulating layer protects the electrodes against the short circuit and simplifies design.…”

Section: Introductionmentioning

confidence: 99%

“…However, a conformal electrode method based on the electrochemical growth of conformal electrodes has been proposed [2]. Coolers utilizing vacuum nanogap were studied in a number of earlier works [3][4][5][6][7]. It has been shown that MVM junction cooling power is of the order of 100 W/cm 2 [3,5].…”

Section: Introductionmentioning

confidence: 99%

“…In recent years, micro-coolers and energy converters based on electron quantum-mechanical tunneling have been investigated [1][2][3][4][5][6]. The first study of cooling by electron tunneling has been done to avoid overheating in the single-electron transistors [1].…”

Section: Introductionmentioning

confidence: 99%

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Electroplating of Conformal Electrodes for Vacuum Nanogap Tunnel Junction

Jangidze¹,

Tavkhelidze²,

Blagidze³

et al. 2012

J. Electrochem. Soc.

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In this study, we electroplate Cu electrode on Si substrate to realize a large-area vacuum nanogap for electron tunneling. We used cathode coating, cathode rotation, asymmetric current regime, and electrolyte temperature stabilization to obtain the regular geometry of the Cu electrode and reduce its internal tension. Subsequently, internal tension was altered to achieve the predefined surface curvature (concave or convex). For 12-mm diameter Ag/Cu electrode, we achieve the curvature of 40 nm/mm from the Ag side. Reduction of the electrode diameter to 3 mm allowed curvature as low as of 2.5 nm/mm. It also allowed fabrication of two conformal electrodes having a nanogap of less than 5 nm wide, over the area of 7 mm 2 . Such electrodes can be used for efficient energy conversion and cooling in the mixed thermionic and thermotunneling regime.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Electroplating of Conformal Electrodes for Vacuum Nanogap Tunnel Junction

Jangidze¹,

Tavkhelidze²,

Blagidze³

et al. 2012

J. Electrochem. Soc.

View full text Add to dashboard Cite

show abstract

“…However, a conformal electrode method based on the electroplating of a top electrode has been proposed [2]. Coolers utilizing vacuum nanogaps have been studied in a number of earlier publications [3][4][5][6][7]. It has been shown that the cooling power of MVM junctions is high, on the order of 100 W/cm 2 [3,5].…”

Section: Introductionmentioning

confidence: 99%

“…In recent years, micro-coolers and energy converters based on electron tunneling have been investigated [1][2][3][4][5][6]. The earlier study of cooling by electron tunneling was conducted to prevent overheating in single-electron transistors [1].…”

Section: Introductionmentioning

confidence: 99%

Vacuum nanogap formation in multilayer structures by an adhesion-controlled process

et al. 2013

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In this study, we regulate adhesion between thin metal films to produce a large-area vacuum nanogap for electron tunneling. Multilayer structures comprising thin metal films with adjustable adhesion were fabricated. The Cu/Ag/Ti/Si structures were grown on Si substrates and include thin Ti and Ag films and a thick Cu layer. The Ag and Ti films were deposited on the Si substrate under vacuum, and a thick Cu layer was subsequently electroplated onto the Ag surface. Later, the sandwich was separated and a vacuum nanogap was opened to produce two Ag/Cu and Ti/Si conformal electrodes. The adhesion strength between the Ti and Ag films was precisely adjusted by exposing the structures to dry O 2 after Ti growth but before Ag growth. The resulting adhesion needed to be sufficiently high to allow electroplating of Cu and sufficiently low to allow subsequent separation. Either heating or cooling was used to separate the sandwiches. T he structures separated as a result of the different thermal expansion parameters of the Si and Cu electrodes and the low adhesion between the Ti and Ag layers. After separation, the Ag and Ti surfaces were analyzed optically using a Michelson interferometer. Adhesion regulation and optimization of the electroplating regime allowed fabrication of two conformal electrodes with a nanogap smaller than 5 nm and an area larger than 7 mm 2 . Such electrodes can be used for efficient energy conversion and cooling in the mixed thermionic and thermotunneling regime.

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Evolution of photoresist layer structure and surface morphology under fluorocarbon‐based plasma exposure

Pranda

Razo

Fourkas

et al. 2019

Plasma Processes & Polymers

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Ion bombardment of photoresist materials during plasma etching results in the formation of a surface dense amorphous carbon (DAC) layer that contributes to both etch resistance and the development of surface roughness. Real‐time ellipsometric measurements/analysis reveals that a C4F8‐containing plasma interacts with an Ar‐plasma‐formed DAC layer to produce a modified DAC/fluorocarbon (FC) layer by FC deposition/diffusion of fluorine into the surface. The depletion of the DAC layer via modification and ion bombardment causes the etch rate of the bulk layer to increase. As the modified surface layer is formed, a noticeable decrease in surface roughness decrease is observed. These findings provide an understanding of the mechanisms of atomic layer etching processes in photoresist materials.

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Thermotunnel refrigerator with vacuum/insulator tunnel barrier: A theoretical analysis

Abstract: Thermosize effects and thermodynamic analysis of a macro/nano scaled refrigerator cycle

Cited by 13 publications

References 4 publications

Electroplating of Conformal Electrodes for Vacuum Nanogap Tunnel Junction

Electroplating of Conformal Electrodes for Vacuum Nanogap Tunnel Junction

Vacuum nanogap formation in multilayer structures by an adhesion-controlled process

Evolution of photoresist layer structure and surface morphology under fluorocarbon‐based plasma exposure

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