Thermostable waterproof polymer materials based on latent self-curing oligomer 4,4′-bis(glycidylamino)-3,3′-dichlorodiphenylmethane

Synthesis and properties of polymeric materials prepared by polymerization of epoxy oligomers with N,N′-carbonyldiimidazole transformation products

“…The following chemicals were used: N,N '-carbonyldiimidazole (CDI; Alfa Aesar, the United Kingdom); ED-20 epoxy-4,4'-isopropylidenediphenol resin [GOST (State Standard) 10587-84; weight fraction of epoxy groups 21.4% and of hydroxy groups 1.5%; dynamic viscosity at 25°С 14 Pa s); ethanol (analytically pure grade); 4,4'-bis(glycidylamino)-3,3'-dichlorodiphenylmethane oligomer (ESOD oligomer) synthesized by the reaction of epichlorohydrin with 4,4'-diamino-3,3'-dichlorodiphenylmethane, followed by dehydrochlorination with NaOH (weight fraction of epoxy groups 19.70%, dynamic viscosity at 50°С 4.35 Pa s; weight fraction of NH groups 7.1%) [8]. Polymerization of epoxy oligomers with CDI transformation products was studied by DSC with a DSC 822 e calorimeter (Mettler-Toledo, Switzerland) in the dynamic mode at a heating rate of 0.08 deg s -1 in the temperature interval 25-300°С.…”

One-pack epoxy adhesives containing latent hardeners

“…In [8,9], we showed the possibility of creating ther mostable epoxy binders and polymer materials based on oligomers that are self hardened under the action of elevated temperatures. The purpose of this work is to study thermostable epoxy composites used as one pack adhesives.…”