2020 IEEE International Reliability Physics Symposium (IRPS) 2020
DOI: 10.1109/irps45951.2020.9129286
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Thermomechanical behaviour of inverse diode in SiC MOSFETs under surge current stress

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Cited by 6 publications
(2 citation statements)
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“…Some studies have demonstrated the surge current capabilities of body-PiN-diodes and built-in SBDs in SiC MOSFETs and their associated failure mechanisms. [16][17][18][19][20][21][22][23] The primary failure mechanism has been found to be heat generations from forward voltage drops with huge surge currents, which can cause to the source metal to melt and/or brake the silicon oxide layers. However, only a few papers have reported the surge current capabilities of SBDs embedded in SiC MOSFETs to the best of our knowledge.…”
Section: Introductionmentioning
confidence: 99%
“…Some studies have demonstrated the surge current capabilities of body-PiN-diodes and built-in SBDs in SiC MOSFETs and their associated failure mechanisms. [16][17][18][19][20][21][22][23] The primary failure mechanism has been found to be heat generations from forward voltage drops with huge surge currents, which can cause to the source metal to melt and/or brake the silicon oxide layers. However, only a few papers have reported the surge current capabilities of SBDs embedded in SiC MOSFETs to the best of our knowledge.…”
Section: Introductionmentioning
confidence: 99%
“…Several studies have demonstrated the surge current capabilities of body-PiNdiodes and embedded Schottky barrier diodes (SBDs) in SiC MOSFETs and their related failure mechanisms. [3][4][5][6][7][8] The main failure mechanism has been found to be the heat generated by forward voltage drops under surge current stress, which melts the source metal and/or ruptures the silicon oxide layers. However, the methodology to improve the surge current capability of the internal diodes in SiC MOSFETs has yet to be demonstrated.…”
Section: Introductionmentioning
confidence: 99%