Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling

Chien, Chi‐Hui; Chen, Y. C.; Hsieh, Chen-Chiung; Chiou, Yii-Tay; Wu, Yii-Der; Chen, T. P.

doi:10.1007/bf02428181

Cited by 14 publications

(3 citation statements)

References 12 publications

(6 reference statements)

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“…From the perspective of brazing metallurgy, it is the interfacial IMC layer formed between the solder and the broad to realize the connection of the brazing head. When the molten Sn-based solder is in contact with the pad matrix, a layer of intermetallic compound (IMC) will be formed at the interface, which is not only controlled by temperature and time in the welding process, but also its thickness will increase with the progression of time in the later service [36]. Studies have shown that fine intermetallic compounds distributed in mass in solder can improve the creep and fatigue resistance of the solder, while thick intermetallic compounds distributed in the interfacial layer are brittle, which will reduce the mechanical integrity of the interface, weaken the interface, and cause damage of solder joints at the boundary between the compound and solder, resulting in the decline of welding fracture toughness and lowcycle fatigue resistance.…”

Section: Microstructure Evolution Of Solder Joint Thermal Fatiguementioning

confidence: 99%

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review

Li,

Du,

Chen

et al. 2024

Materials

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In electronic packaging products in the service process, the solder joints experience thermal fatigue due to temperature cycles, which have a significant influence on the performance of electronic products and the reliability of solder joints. In this paper, the thermal fatigue failure mechanism of solder joints in microelectronic packages, the microstructure changes of the thermal fatigue process, the influence factors on the joint fatigue life, and the simulation analysis and forecasting of thermal fatigue life are reviewed. The results show that the solder joints are heterogeneously coarsened, and this leads to fatigue cracks occurring under the elevated high-temperature phase of alternating temperature cycles. However, the thickness of the solder and the hold time in the high-temperature phase do not significantly influence the thermal fatigue. The coarsened region and the IMC layer thicken with the number of cycles, and the cracks initiate and propagate along the interface between the intermetallic compound (IMC) layer and coarsened region, eventually leading to solder joint failure. For lead-containing and lead-free solders, the lead-containing solder shows a faster fatigue crack growth rate and propagates by transgranular mode. Temperature and frequency affect the thermal fatigue life of solder joints to different degrees, and the fatigue lifetime of solder joints can be predicted through a variety of methods and simulated crack trajectories, but also through the use of a unified constitutive model and finite element analysis for prediction.

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Section: Microstructure Evolution Of Solder Joint Thermal Fatiguementioning

confidence: 99%

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review

Li,

Du,

Chen

et al. 2024

Materials

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“…With the development of high-density semiconductor packages, to achieve high functions including heat resistance, toughness, heat dissipation, etc., more and more attention has been focused on the underfill (hereinafter referred to as UF) which is a semiconductor encapsulant resin [1]. However, due to the strong nonlinearity of the UF physical properties and the complex micro-nano compositions, optimum design of UF is quite difficult.…”

Section: Introductionmentioning

confidence: 99%

Residual Thermal Strain Distribution Measurement of Underfills in Flip Chip Electronic Packages by an Inverse Approach Based on the Sampling Moiré Method

Wang

Enomoto³

2020

Exp Mech

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Residual deformation evaluation of underfill (UF) materials in flip chips is crucial to improve the reliability of electronic packages. In this study, we propose to evaluate the residual thermal strain distributions using an inverse method based on the sampling moiré technique. Even if a grid pattern is fabricated on the specimen at room temperature, the residual strain distributions at an arbitrary temperature relative to the specimen formation temperature can be successfully calculated. The residual strain distributions relative to the free contraction state at an arbitrary temperature can also be measured when the coefficient of thermal expansion is available. A thermal chamber for flip chips was designed under a laser scanning microscope. Using the proposed method, the normal, shear and principal internal strain distributions and deformation characteristics of two kinds of UFs in flip chips were investigated relative to 150 °C. The strains of the UF with low glass transition temperature (UF-A) concentrate near the die material, especially at the die corner, while the strain concentration of the underfill with high glass transition temperature (UF-B) mainly occurs at the die corner and the buffer layer. The maximum principal strain of UF-A is greater than that of UF-B around the die corner. The residual maximum principal strain distributions relative to the free contraction state at 25 °C were compared with the simulation results by the finite element method. The residual strain distribution trends from experiments are consistent with those from simulations.

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“…The main mechanism of adhesion for most adhesive/substrate interfaces is described by adsorption theory. This theory states that materials adhere due to the interatomic and intermolecular forces that are established between the surfaces of the adhesive and substrate [5]. In practice, there are two different ways of characterizing interfacial adhesion [4].…”

Section: Introductionmentioning

confidence: 99%

Temperature Effect of Interfacial Fracture Toughness on Underfill for Pb-Free Flip Chip Packages

Park

Tang

Chung

2007

2007 Proceedings 57th Electronic Components and Technology Conference

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In this study, the interfacial fracture toughness between passivation layer and underfill was investigated at elevated temperatures by performing conventional four-point bending test and finite element simulation. Since the board level reflow temperature for Pb-free flip chip packaging is reaching as high as 260 °C, the concern about delamination at the interfaces between underfill and its surrounding components becomes a more serious reliability issue. To estimate the interfacial strength, interfacial fracture toughness at a specific mixed mode loading condition is calculated. As temperature is increased, the interracial toughness was also increased up to the glass transition temperature. Beyond the glass transition temperature, however, interfacial fracture toughness is decreased.

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Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling

Cited by 14 publications

References 12 publications

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review

Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review

Residual Thermal Strain Distribution Measurement of Underfills in Flip Chip Electronic Packages by an Inverse Approach Based on the Sampling Moiré Method

Temperature Effect of Interfacial Fracture Toughness on Underfill for Pb-Free Flip Chip Packages

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