Thermomechanical analysis of gold-based SiC die-attach assembly

Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

“…An increase by 10% of porosity leads to a decrease by 4% of Young modulus. This void dependency appears also for die attaches made by other materials [4].…”

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

“…Hard solder alloys based on gold are interesting candidates for SiC devices assembly [5,9,10], since they have a melting temperature of above 250°C. However, eutectic Au-Si die bonding, very popular in silicon technology, cannot be used for SiC die bonding due to a strong atomic bond in hexagonal crystallographic SiC lattices [5].…”

“…High-lead (Pb) solders, such as Pb-5Sn and Pb-10Sn (mass%) alloys with melting points of 310°C and 305°C, respectively, are presently granted immunity from the Restriction of Hazardous Substances (RoHS) requirements for their use in electronic systems operating in a high temperature and pressure, especially in military, geophysical logging and space applications [6][7][8]. However, the efforts to develop Pb-free replacements for the high temperature applications have achieved very limited success so far.Hard solder alloys based on gold are interesting candidates for SiC devices assembly [5,9,10], since they have a melting temperature of above 250°C. However, eutectic Au-Si die bonding, very popular in silicon technology, cannot be used for SiC die bonding due to a strong atomic bond in hexagonal crystallographic SiC lattices [5].…”

Research on eutectic bonding processes and interfacial damage features in high power LED package

“…Au-Sn eutectic alloy is also an interesting approach for high-power LED devices assembly, because it has higher melting temperature, good wettability and higher thermal conductivity [9][10][11][12]. Eutectic bonging technology may be the most promising die-attach process in high power LED packaging.…”