Thermokinetics behavior of epoxy adhesive reinforced with low viscous aliphatic reactive diluent and nano-fillers

Singh, Amit Kumar; Panda, Bishnu P.; Mohanty, Smita; Nayak, Sanjay K.; Gupta, Manoj Kumar

doi:10.1007/s11814-017-0221-z

Cited by 18 publications

(12 citation statements)

References 38 publications

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“…[ 39 ] Moreover, formation of discrete domains in the RB adhesives at alkaline pH, 8.0 and 10.0 act as diluents that decrease the reactivity of the long‐chain polymeric molecules, thereby resulting in increasing the value of E a . [ 27 ] Singh et al. [ 27 ] reported that the value of the activation energy, E a , of epoxy resin was increased from 45 to 60 kJ mol −1 by addition of aliphatic reactive diluents (RD) into the epoxy resin.…”

Section: Resultsmentioning

confidence: 99%

“…[ 27 ] Singh et al. [ 27 ] reported that the value of the activation energy, E a , of epoxy resin was increased from 45 to 60 kJ mol −1 by addition of aliphatic reactive diluents (RD) into the epoxy resin. [ 27 ] The presence of RD in the epoxy resin acts as catalysts for deactivation of the reactive epoxy polymeric molecules.…”

Section: Resultsmentioning

confidence: 99%

“…[ 27 ] reported that the value of the activation energy, E a , of epoxy resin was increased from 45 to 60 kJ mol −1 by addition of aliphatic reactive diluents (RD) into the epoxy resin. [ 27 ] The presence of RD in the epoxy resin acts as catalysts for deactivation of the reactive epoxy polymeric molecules. The slight decrease in E a values at pH 10.0 can be ascribed to blocking the active sites for formation of hydrogen bonding of the RB adhesive molecules by sodium ions.…”

Section: Resultsmentioning

confidence: 99%

“…According to the Kissinger equation, the values of activation energy can be obtained from the slope by plotting ln(β/ T P 2 ) versus (1/ T P ) [ 26 ]

\begin{matrix} E_{normala} = - R \frac{d (\ln (\frac{β}{T_{normalp}^{2}}))}{d (\frac{1}{T_{normalp}})} \end{matrix}

where E a is the activation energy (kJ mol –1 ), R is the universal gas constant (8.315 J mol –1 K –1 ), β is the constant heating rate, and T p is the maximum peak temperature obtained from plots of heat flow versus temperature. [ 27 ]…”

Section: Methodsmentioning

confidence: 99%

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Preparation and Evaluation of Rice Bran‐Modified Urea Formaldehyde as Environmental Friendly Wood Adhesive

et al. 2021

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In this study, defatted rice bran (RB) is used to prepare an environmentally friendly adhesive through chemical modifications. The RB is mixed with distilled water with ratios of 1:5 and 1:4 to prepare Type A and Type B adhesives, respectively having pH of 6, 8 and 10. Type A adhesive is prepared by treating RB with 1% potassium permanganate and 4% poly(vinyl alcohol), whereas Type B is formulated by adding 17.3% formaldehyde and 5.7% urea to RB. Viscosity, gel time, solid content, shear strength, Fourier transform infrared (FTIR) spectroscopy is carried out, and glass transition temperature (Tg), and activation energy (Ea) are determined to evaluate the performance of the adhesives. Ea data reveal that adhesives prepared at mild alkaline (pH 8) form long‐chain polymers. Gel time is higher in the fabricated adhesives than that of the commercial urea formaldehyde (UF). FTIR data suggest that functional groups of the raw RB are chemically modified, which enhances the bondability of the adhesives. Shear strength data indicates that bonding strength increases with increasing pH. Similar results are also observed for physical and mechanical properties of fabricated particleboards with the adhesives. The results demonstrate that RB‐based adhesives can be used as a potential alternative to currently used UF‐based resin.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

“…According to the Kissinger equation, the values of activation energy can be obtained from the slope by plotting ln(β/ T P 2 ) versus (1/ T P ) [ 26 ]

\begin{matrix} E_{normala} = - R \frac{d (\ln (\frac{β}{T_{normalp}^{2}}))}{d (\frac{1}{T_{normalp}})} \end{matrix}

Section: Methodsmentioning

confidence: 99%

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Preparation and Evaluation of Rice Bran‐Modified Urea Formaldehyde as Environmental Friendly Wood Adhesive

et al. 2021

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“…The curing process occurs at a higher temperature because of the impeded crosslinking of the polymer chains. Moreover, the peak intensity decreases compared to neat epoxy because less heat is generated per unit mass due to the additional filler [ 26 ]. Coalescence behavior is confirmed by the endothermic peak at 220 °C, corresponding to the melting of SAC305 particles.…”

Section: Resultsmentioning

confidence: 99%

3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity

Kim

2020

Polymers

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In this study, hybrid fillers of spherically shaped aggregated boron nitride (a-BN) attached with SAC305, were fabricated via simple stirring and the vacuum filtration method. a-BN was used as the primary conductive filler incorporated with epoxy resin, and these fillers were interconnected each other via the coalescence behavior of SAC305 during the thermal curing process. Based on controlled a-BN content (1 g) on 3 g of epoxy, the thermal conductivity of the composite filled with hybrid filler (a-BN:SAC305 = 1:0.5) reached 0.95 W/mK (33 wt%) due to the construction of the 3D filler network, whereas that of composite filled with raw a-BN was only 0.60 W/mK (25 wt%). The thermal conductivity of unfilled epoxy was 0.19 W/mK.

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Formulation and Characterization of Formaldehyde‐Free Chemically Modified Bone‐Based Adhesive for Lignocellulosic Composite Products

et al. 2021

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This study investigates the efficacy of chemically modified bone adhesive as a formaldehyde‐free binder for wood‐based industries. Two different types of adhesive are formulated after chemical modification of bone powder using sulfuric acid (0.5 m) and polyvinyl acetate (PVA). Gel time, solid content, Fourier‐transform infrared spectroscopy (FT‐IR), thermogravimetric analysis (TGA), viscosity, and single lap joint test for shear strength are analyzed in order to assess the adhesive properties. To analyze the efficacy of the formulated adhesive, particleboards are fabricated using boiled and unboiled sugarcane bagasse. The physical and mechanical properties of the fabricated panels are measured following ASTM standards. It is found that adhesive Type C (T‐C) has the shortest gel time of 4.2 min for the highest shear strength, i.e., 5.31 MPa. The particleboard (BTC‐2) fabricated using T‐C adhesive shows a highest density of 0.73 g cm−3, a modulus of elasticity (MOE) of 1975 N mm−2, and a modulus of rupture (MOR) of 11.80 N mm−2. The dimensional stability of the fabricated particleboards does not follow the standard requirements; however, further study might be helpful for using the chemically modified bone adhesive as a biobased adhesive.

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Thermokinetics behavior of epoxy adhesive reinforced with low viscous aliphatic reactive diluent and nano-fillers

Cited by 18 publications

References 38 publications

Preparation and Evaluation of Rice Bran‐Modified Urea Formaldehyde as Environmental Friendly Wood Adhesive

Preparation and Evaluation of Rice Bran‐Modified Urea Formaldehyde as Environmental Friendly Wood Adhesive

3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity

Formulation and Characterization of Formaldehyde‐Free Chemically Modified Bone‐Based Adhesive for Lignocellulosic Composite Products

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