Thermoelectric properties of pressed bismuth nanoparticles

Hostler, Stephen R.; Qu, Yu Qiao; Demko, Michael T.; Abramson, Alexis R.; Qiu, Xiaoqing; Burda, Clemens

doi:10.1016/j.spmi.2007.10.001

Cited by 27 publications

(18 citation statements)

References 22 publications

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“…The characterization of thermoelectric properties with respect to various fabrication conditions, such as mesh size (100-mesh and 200-mesh), pressure (200 MPa and 300 MPa), and binder to TE material weight ratio (1:500, 1:1000, 1:2000, and 1:5000) was demonstrated. We successfully made high performing chitosan-bismuth composite TE films and their electrical conductivity and Seebeck coefficient values were comparable to the values of bulk bismuth [35,36]. The scanning electron microscope (SEM) images and density measurements confirmed that the chitosan-bismuth composite films had bulk-like structure.…”

Section: Introductionmentioning

confidence: 94%

Thermoelectric Performance Enhancement of Naturally Occurring Bi and Chitosan Composite Films Using Energy Efficient Method

et al. 2020

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This work presents an energy efficient technique for fabricating flexible thermoelectric generators while using printable ink. We have fabricated thermoelectric composite thick films using two different mesh sizes of n-type bismuth particles, various binder to thermoelectric material weight ratios, and two different pressures, 200 MPa and 300 MPa, in order to optimize the thermoelectric properties of the composite films. The use of chitosan dissolved in dimethylsulfoxide with less than 0.2 wt. % of chitosan, the first time chitosan has been used in this process, was sufficient for fabricating TE inks and composite films. Low temperature curing processes, along with uniaxial pressure, were used to evaporate the solvent from the drop-casted inks. This combination reduced the temperature needed compared to traditional curing processes while simultaneously increasing the packing density of the film by removing the pores and voids in the chitosan-bismuth composite film. Microstructural analysis of the composite films reveals low amounts of voids and pores when pressed at sufficiently high pressures. The highest performing composite film was obtained with the weight ratio of 1:2000 binder to bismuth, 100-mesh particle size, and 300 MPa of pressure. The best performing bismuth chitosan composite film that was pressed at 300 MPa had a power factor of 4009 ± 391 μW/m K2 with high electrical conductivity of 7337 ± 522 S/cm. The measured thermal conductivity of this same sample was 4.4 ± 0.8 W/m K and the corresponding figure of merit was 0.27 at room temperature.

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Section: Introductionmentioning

confidence: 94%

Thermoelectric Performance Enhancement of Naturally Occurring Bi and Chitosan Composite Films Using Energy Efficient Method

et al. 2020

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“…Several studies [2,[7][8][9] have shown increases in the figure of merit through incorporation of defects, inclusions, and nanoparticles in the hopes of decreasing the phonon thermal conductivity (k p ). Kim et al [2] have experimentally studied embedded nanocrystals in a matrix material and saw a noticeable decrease in the thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties

Musho

Walker

2012

Nanoscale and Microscale Thermophysical Engineering

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The electrical transport properties of semiconductor nanocrystalline composite (NCC) thermoelectric structures were studied from a quantum point of view using a 2D non equilibrium Green's function (NEGF) computational approach. Previous researchers have shown enhancement in thermal properties of NCC devices but have not extensively studied their electrical transport properties for increased thermoelectric performance. The NCC structure was parameterized to determine the performance as a function of crystal spacing and crystal size. Results indicate that a silicon matrix (well) and a germanium crystal (barrier) configuration result in the highest Seebeck coefficient. Power factors of NCC devices were compared to equivalent superlattice devices, and greater performance was shown for equivalent NCC characteristic lengths.

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“…Bismuth is a semimetal with unusual electronic properties [1], promising thermoelectric properties [2] and very large magnetoresistance [3]. Bismuth nanomaterials are attracting more attention due to their potential applications as magnetic field sensor, thermoelectric cooler and power generator.…”

Section: Introductionmentioning

confidence: 99%