2005
DOI: 10.1557/proc-0886-f11-13
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Thermoelectric properties of Mg2Si1−xCx crystals grown by the vertical Bridgman method

Abstract: Multicrystalline Mg 2 Si crystals were grown using a Brigdman method combined with a die-casting growth technique. Although molten and/or vapor-phase Mg at elevated growth temperatures exhibit high chemical reactivity with the surrounding crucible materials, the use of an alumina crucible with a BN coating allowed single phase crystal growth and Mg 2 Si of good crystalline quality. Incorporation of carbon into the Mg 2 Si was observed to form Mg 2 Si 1-x C x . For x=0.01 and 0.03, a lower thermal conductivity … Show more

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Cited by 2 publications
(4 citation statements)
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“…Nevertheless, it may play an important role in upcoming new matarials for photo voltaics. It is indeed a semiconductor with a bandgap of 0.77 eV [2]. Additionally, it is consisting of non-poisonous elements and possesses a reasonably low melting temperature of 1102 °C.…”
mentioning
confidence: 99%
“…Nevertheless, it may play an important role in upcoming new matarials for photo voltaics. It is indeed a semiconductor with a bandgap of 0.77 eV [2]. Additionally, it is consisting of non-poisonous elements and possesses a reasonably low melting temperature of 1102 °C.…”
mentioning
confidence: 99%
“…The BN-based anti-adhesion coating on the alumina crucible can provide a non-stick condition in a very reproducible manner. As has been reported previously, the growth of Mg 2 Si could also be achieved using BN crucibles, such as hexagonal or pyrolytic BN, and dense graphite and alumina crucibles with BN encapsulation [15,16]. In view of crucible fabrication costs, graphite or alumina with BN encapsulation seem to be realistic.…”
Section: Crystal Growth Of Mg 2 Simentioning
confidence: 84%
“…Seebeck coefficient and electrical conductivity of the grown ingot over the range from 345 to 840 K. Data for the non-encapsulated sample were obtained from Ref. [16]. highly temperature-dependent Seebeck coefficient, a lower electrical conductivity and phonon-oriented thermal conductivity, compared to the sample with no anti-adhesion encapsulation.…”
Section: Discussionmentioning
confidence: 99%
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