Thermoelectric Properties of CoSb&lt;sub&gt;3&lt;/sub&gt; Nanoparticle Films

Yang, Ya Jun; Liu, Xian Yun; Wang, Xudong; Jiang, Meiping; Chen, Xianfeng; Ma, Ji; Jiang, Xing Fang; Huang, Yuan Ming

doi:10.4028/www.scientific.net/amr.347-353.3448

Cited by 1 publication

(1 citation statement)

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“…Moreover, unlike the use of common rigid substrates (such as silicon wafers 28 , glass 32 , and quartz 35 , seen in Supplementary Table 1 ), all thin film preparation processes need to be re-explored and optimized to address the compatibility issue between skutterudite thin films and high-temperature flexible organic substrates. In this study, we utilized self-designed high-purity targets and employed advanced pulsed laser deposition (PLD) techniques to prepare p-type Fe 3 CoSb 12 -based flexible thermoelectric thin films (Supplementary Fig.…”

Section: Resultsmentioning

confidence: 99%

High-performance flexible p-type Ce-filled Fe3CoSb12 skutterudite thin film for medium-to-high-temperature applications

Li,

Shi,

Zhu

et al. 2024

Nat Commun

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P-type Fe3CoSb12-based skutterudite thin films are successfully fabricated, exhibiting high thermoelectric performance, stability, and flexibility at medium-to-high temperatures, based on preparing custom target materials and employing advanced pulsed laser deposition techniques to address the bonding challenge between the thin films and high-temperature flexible polyimide substrates. Through the optimization of fabrication processing and nominal doping concentration of Ce, the thin films show a power factor of >100 μW m−1 K−2 and a ZT close to 0.6 at 653 K. After >2000 bending cycle tests at a radius of 4 mm, only a 6 % change in resistivity can be observed. Additionally, the assembled p-type Fe3CoSb12-based flexible device exhibits a power density of 135.7 µW cm−2 under a temperature difference of 100 K with the hot side at 623 K. This work fills a gap in the realization of flexible thermoelectric devices in the medium-to-high-temperature range and holds significant practical application value.

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Section: Resultsmentioning

confidence: 99%