Thermoelastic analysis of nonhomogeneous structural materials with an interface crack under uniform heat flow

Ding, Shenghu; Li, Xing

doi:10.1016/j.amc.2015.08.103

Cited by 4 publications

(1 citation statement)

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“…In addition, assuming the surfaces of the crack are insulated, thermal stresses around a crack in the interfacial layer between two dissimilar elastic half-planes are studied by Itou (2004). With the introduction of the thermal resistance concept, the thermal stress intensity factors for the interface crack between functionally graded layered structures under the thermal loading are investigated by Ding and Li (2015). Zhou and Lee (2011) studied the thermal fracture problem of a functionally graded coating-substrate structure of finite thickness with a partially insulated interface crack subjected to thermal–mechanical supply.…”

Section: Introductionmentioning

confidence: 99%

Interface crack between different orthotropic media under uniform heat flow

Ding

2016

SpringerPlus

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In this paper, plane thermo-elastic solutions are presented for the problem of a crack in two bonded homogeneous orthotropic media with a graded interfacial zone. The graded interfacial zone is treated as a nonhomogeneous interlayer having spatially varying thermo-elastic moduli between dissimilar, homogeneous orthotropic half-planes, which is assumed to vary exponentially in the direction perpendicular to the crack surface. Using singular integral equation method, the mixed boundary value conditions with respect to the temperature field and those with respect to the stress field are reduced to a system of singular integral equations and solved numerically. Numerical results are obtained to show the influence of non-homogeneity parameters of the material thermo-elastic properties, the orthotropy parameters and the dimensionless thermal resistance on the temperature distribution and the thermal stress intensity factors.

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Section: Introductionmentioning

confidence: 99%