Thermodynamic study and re-assessment of the Ge-Ni system

Jin, S.; Leinenbach, Christian; Wang, Jiang; Duarte, Liliana I.; Delsante, S.; Borzone, G.; Scott, A. J.; Watson, Andrew

doi:10.1016/j.calphad.2012.03.003

Cited by 26 publications

(24 citation statements)

References 39 publications

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“…More recently, further work has been also reported by Liu et al [3] and by Jin et al [4]. Ni 5 Ge 3 is a congruently melting compound with a homogeneity range for the single phase compound of 34.6 -44.5 at.% Ge.…”

Section: Introductionmentioning

confidence: 75%

“…Ni 5 Ge 3 is a congruently melting compound with a homogeneity range for the single phase compound of 34.6 -44.5 at.% Ge. The congruent point is towards the Ge-deficient end of this range at 37.2 at.% Ge and 1458 K. Ni 5 Ge 3 displays two equilibrium crystalline forms, and ' [2] [4]. The high temperaturephase has the P6 3 /mmc crystal structure (Hexagonal, space group 194), while the low temperature '-phase has the C2 crystal structure (Monoclinic, space group 5) [4].…”

Section: Introductionmentioning

confidence: 99%

“…The congruent point is towards the Ge-deficient end of this range at 37.2 at.% Ge and 1458 K. Ni 5 Ge 3 displays two equilibrium crystalline forms, and ' [2] [4]. The high temperaturephase has the P6 3 /mmc crystal structure (Hexagonal, space group 194), while the low temperature '-phase has the C2 crystal structure (Monoclinic, space group 5) [4]. The transition between the two occurs either congruently (  ') at 670 K for Ge-rich compositions or via the eutectoid reaction  ' +  at 560 K for Ge-deficient compositions.…”

Section: Introductionmentioning

confidence: 99%

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Mechanical Properties of Rapidly Solidified Ni5Ge3 Intermetallic

Haque

Mullis

2018

The Minerals, Metals &Amp; Materials Series

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The congruently melting, single phase, intermetallic Ni 5 Ge 3 has been subject to rapid solidification via drop-tube processing wherein powders with diameters between 850 -150 m are produced. At these cooling rates (850 -150 m diameter particles, 700 -7800 K s -1 ) the dominant solidification morphology, revealed after etching, is that of isolated plate & lath microstructure in an otherwise featureless matrix. Selected area diffraction analysis in the TEM reveals the plate & lath are a disordered variant of -Ni 5 Ge 3 , whilst the featureless matrix is the ordered variant of the same compound. Microvicker hardness test result shows that mechanical properties improve with decreasing the particle size from 850 to 150 m as a consequence of increasing the cooling rate.

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Section: Introductionmentioning

confidence: 75%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Mechanical Properties of Rapidly Solidified Ni5Ge3 Intermetallic

Haque

Mullis

2018

The Minerals, Metals &Amp; Materials Series

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“…Au;Ni , and L u Ge;Ni are the interaction parameters taken from the corresponding binary systems [18][19][20].…”

Section: Solution Phasesmentioning

confidence: 99%

“…In the present optimization, the thermodynamic parameters of the Au-Ge, Au-Ni, and Ge-Ni binary subsystems are taken from [18], [19], and [20], respectively.…”

Section: Thermodynamic Modelingmentioning

confidence: 99%

Experimental investigation and thermodynamic modeling of the Au–Ge–Ni system

et al. 2012

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Phase equilibria in the Au-Ge-Ni ternary system were studied by means of scanning electron microscopy, electron probe microanalysis, X-ray diffraction, and differential scanning calorimetry. The phase relations in the solid state at 600°C as well as a vertical section at Au 72 Ge 28 -Ni were established. No ternary compound was found at 600°C. On the basis of the experimental phase equilibria data, a thermodynamic model of the Au-Ge-Ni ternary system was developed using the CALPHAD method. Thermodynamically calculated phase diagrams are shown at 600°C, in two vertical sections and the liquidus projection. Reasonable agreement between the calculations and the experimental results was achieved.

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Characterization of the isothermal solidification process in the Ni/Au–Ge layer system

Weyrich

Leinenbach

2015

J Mater Sci

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The eutectic Au28Ge (at.%) solder alloy in combination with Ni substrates or Ni coatings is interesting for applications in transient liquid phase (TLP) bonding. To achieve sound joints with high re-melting temperatures, it is necessary to gain profound knowledge about the joining process. In this work, the isothermal solidification behavior in the Ni-Au28Ge (at.%) system was analyzed by means of microstructure evolution and time to complete solidification. In short-time annealing experiments the early stage of the reaction (\300 s over liquidus temperature) was investigated. It was observed that a continuous layer of Ni 5 Ge 3 forms at the substrate-solder interface before scallop-like NiGe grains start to grow as solidification proceeds. Cyclic differential scanning calorimetry measurements were applied to estimate the time to complete solidification. Solidification was completed after less than 1 h in the Ni-Au28Ge (at.%) system, which enables comparably short processing times for TLP bonding.

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Thermodynamic study and re-assessment of the Ge-Ni system

Cited by 26 publications

References 39 publications

Mechanical Properties of Rapidly Solidified Ni5Ge3 Intermetallic

Mechanical Properties of Rapidly Solidified Ni5Ge3 Intermetallic

Experimental investigation and thermodynamic modeling of the Au–Ge–Ni system

Characterization of the isothermal solidification process in the Ni/Au–Ge layer system

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