Thermodynamic simulations of SrTiO3/epoxy nanocomposites with different mass fractions

Wen, Hao; Zhang, Xiaoxing; Xia, Rong; Yang, Zilai; Wu, Yunjian

doi:10.1007/s42452-019-0363-1

Cited by 3 publications

(1 citation statement)

References 24 publications

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“…Materials with high K and minimum CTE mismatch between the heat source and heat sink are in great demand for electronic packaging applications. Polymer composites reinforcing with highly thermal conducting inorganic fillers have attracted increasing attention in this field [3][4][5][6][7]. Though pure polymers have very low thermal conductivity (0.1-0.3 W m -1 K -1 ), controlling such inorganic fillers in the polymer matrix can significantly increase the thermal conductivity and reduce the CTE along all directions, which will meet the requirement for thermal management and electronic packaging applications.…”

Section: Graphical Abstract Introductionmentioning

confidence: 99%

Thermally conductive poly(ether ether ketone)/boron nitride composites with low coefficient of thermal expansion

Ghosh

Hou

2021

J Mater Sci

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The substantial heat generation due to miniaturization and high-degree integration of electronic devices is one of the major issues to facilitate efficient thermal management in power electronics. Though epoxy-based composites have shown great interest in different applications such as laminated circuit board, electronic component encapsulations, and potting, they have low application temperature (up to 150 °C) and higher mismatch of coefficient of thermal expansion (CTE) between the heat source and heat sink. Here, poly(ether ether ketone) (PEEK) composites reinforced with hexagonal boron nitride (hBN) nanoplatelets have been developed by liquid mixing and re-melting method for a step change in composite materials with lower CTE and significantly improved thermal dissipation capability. The lowest achieved CTE is 2.1 µm m−1 K−1, and the highest thermal conductivity is 1.04 W m−1 K−1 in PEEK/hBN composites at 30 wt% hybrid hBN content (hBN platelets with two different sizes, i.e. 70 nm and 500 nm, taken as 1:1 weight ratio), due to the formation of thermally conductive inter-filler networks. The composites show negligible variation in K with the working temperature up to 250 °C. The developed composites also exhibit excellent electrical insulation properties; thus, they will have good potential in thermal management for power electronic applications. Graphical abstract

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Section: Graphical Abstract Introductionmentioning

confidence: 99%

Thermally conductive poly(ether ether ketone)/boron nitride composites with low coefficient of thermal expansion

Ghosh

Hou

2021

J Mater Sci

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The improvement mechanism of styrene grafted nano-Al2O3 on the hydrophobicity of epoxy resin composites: Based on molecular dynamics and experimental research

Bi,

Tong,

Xie

et al. 2024

Materials Today Communications

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Synergistic Effects of Boron Nitride (BN) Nanosheets and Silver (Ag) Nanoparticles on Thermal Conductivity and Electrical Properties of Epoxy Nanocomposites

Zhang

Negi

et al. 2020

Polymers

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Polymer composites, with both high thermal conductivity and high electrical insulation strength, are desirable for power equipment and electronic devices, to sustain increasingly high power density and heat flux. However, conventional methods to synthesize polymer composites with high thermal conductivity often degrade their insulation strength, or cause a significant increase in dielectric properties. In this work, we demonstrate epoxy nanocomposites embedded with silver nanoparticles (AgNPs), and modified boron nitride nanosheets (BNNSs), which have high thermal conductivity, high insulation strength, low permittivity, and low dielectric loss. Compared with neat epoxy, the composite with 25 vol% of binary nanofillers has a significant enhancement (~10x) in thermal conductivity, which is twice of that filled with BNNSs only (~5x), owing to the continuous heat transfer path among BNNSs enabled by AgNPs. An increase in the breakdown voltage is observed, which is attributed to BNNSs-restricted formation of AgNPs conducting channels that result in a lengthening of the breakdown path. Moreover, the effects of nanofillers on dielectric properties, and thermal simulated current of nanocomposites, are discussed.

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Thermodynamic simulations of SrTiO3/epoxy nanocomposites with different mass fractions

Cited by 3 publications

References 24 publications

Thermally conductive poly(ether ether ketone)/boron nitride composites with low coefficient of thermal expansion

Thermally conductive poly(ether ether ketone)/boron nitride composites with low coefficient of thermal expansion

The improvement mechanism of styrene grafted nano-Al2O3 on the hydrophobicity of epoxy resin composites: Based on molecular dynamics and experimental research

Synergistic Effects of Boron Nitride (BN) Nanosheets and Silver (Ag) Nanoparticles on Thermal Conductivity and Electrical Properties of Epoxy Nanocomposites

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