Thermodynamic analysis and characterization of Bi–Cu–Sn alloys as advanced lead-free solder materials for high temperature application

Abstract

Due to the frequent use of Cu as a substrate material in electronics, it is of importance to understand the interactions between these solders and the substrate, based on the knowledge of the phase equilibria, thermodynamics and other characteristics of the Bi-Cu-Sn system. The results of thermodynamic analysis and characterization of Bi-Cu-Sn alloys as advanced lead-free solder materials for high temperature application are presented in this paper. The research inlcudes analytical investigations done by thermodynamic predicting according to GSM method and experimental investigations performed by differential thermal analysis, optical microscopy, hardness and electroconductivity measurements.

Evaluation of carbide capacity in CaO-based ternary systems at 1773k for refining process

“…On the contrary, the model prediction is an alternative which may address this issue in a more effective way. The geometrical model [9][10][11] is a powerful tool to predict the properties of slags and has been widely used in the calculation of sulfide capacities [12][13][14], phosphate capacities [15], and other physicochemical properties of slags [15][16][17][18][19][20][21][22][23][24][25][26][27]. Traditional geometrical models [9,11,[28][29][30][31][32] can predict the properties of ternary systems only when the binary data are abundant.…”

Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys

“…Alloys based on those components are considered among others as possible materials for the lead-free solders [1][2][3][4][5]. Systematic experimental and theoretical studies of thermodynamic properties [e.g., [6][7][8][9][10][11][12][13][14] , made by the various research centers partially coordinated by the European actions COST531 [15] and MP609 [16] led to the development of complete thermodynamics descriptions of the binary and ternary systems based on those elements [e.g., [17][18][19][20][21]. Phase boundaries and chemical composition of quaternary Ag-Bi-Cu-Sn system were investigated by Doi at all [22] using differential scanning calorimetry (DSC), optical microscope and a scanning electronic microscope (TEM) while the chemical compositions were determined by energy dispersive X-ray microanalyzer (EDX).…”

Wetting of Cu Pads by Bi-2.6Ag-xCu Alloys and Phase Equilibria in the Ag-Bi-Cu System

“…12 Over the past years, attention has been paid to thermodynamics and phase equilibria in the following ternary systems: Ag-Bi-Sn, 13 Ag-Cu-Sn, 14,15 and Bi-Cu-Sn. 16 Recent experimental information on the thermal behavior of Ag-Bi-Cu alloys 17 and the thermodynamics of liquid 18 facilitates an assessment of the thermodynamic properties of this system. Therefore, the aim of this work is: (1) to experimentally study phase equilibria in the Ag-BiCu system, (2) to assess the phase diagram of the ternary Ag-Bi-Cu system, and (3) to investigate the effect of Cu concentration on the wettability of Bi-Ag eutectic-based solder alloys on the Cu substrate with the presence of the flux, and to characterize the microstructure of the interface between solders and the Cu substrate.…”