Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver

Mei, Yunhui; Lian, Jiaoyuan; Chen, Xu; Chen, Gang; Li, Xin; Lü, Gongxuan

doi:10.1109/tdmr.2013.2280668

Cited by 28 publications

(10 citation statements)

References 37 publications

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“…The thermal reliability of power electronics is one important aspect when sintered silver nanomaterials were used as interconnection materials 99,[114][115][116][117][118][119] . Ratcheting and creep behaviors of sintered joint have been studied at various temperatures and stresses [120][121][122][123][124] .…”

Section: Thermal-mechanical Stabilitiesmentioning

confidence: 99%

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Peng¹,

Gerlich³

et al. 2015

ACS Appl. Mater. Interfaces

295

121

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A review is provided, which first considers low-temperature diffusion bonding with silver nanomaterials as filler materials via thermal sintering for microelectronic applications, and then other recent innovations in low-temperature joining are discussed. The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated. The mechanical and electrical properties of sintered silver nanomaterial joints at low temperatures are discussed in terms of the key influencing factors, such as porosity and coverage of substrates, parameters for the sintering processes, and the size and shape of nanomaterials. Further, the use of sintered silver nanomaterials for printable electronics and as robust surface-enhanced Raman spectroscopy substrates by exploiting their optical properties is also considered. Other low-temperature nanojoining strategies such as optical welding of silver nanowires (NWs) through a plasmonic heating effect by visible light irradiation, ultrafast laser nanojoining, and ion-activated joining of silver NPs using ionic solvents are also summarized. In addition, pressure-driven joining of silver NWs with large plastic deformation and self-joining of gold or silver NWs via oriented attachment of clean and activated surfaces are summarized. Finally, at the end of this review, the future outlook for joining applications with silver nanomaterials is explored.

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Section: Thermal-mechanical Stabilitiesmentioning

confidence: 99%

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Peng¹,

Gerlich³

et al. 2015

ACS Appl. Mater. Interfaces

295

121

View full text Add to dashboard Cite

show abstract

“…Such values correspond well with those of electronic elements – 2.3-4.7 ppm/K for Si and 4.5-4.9 ppm/K for SiC (Jiang, 2010) – and sintered joints exhibit a 10-100 times higher lifetime than standard SnAg3.5 solder joints (Weber et al , 2015b). However, after thermal cycling testing, failures of sintered joints also are observed (Knoerr et al , 2010; Mei et al , 2014a, 2014b; Weber et al , 2015a).…”

Section: Joined Elementsmentioning

confidence: 99%

Technological aspects of silver particle sintering for electronic packaging

Felba

2018

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Purpose This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging. Design/methodology/approach Based on the literature and author’s own experience, the factors influencing the nanosized Ag particle sintering results were identified, and their significance was assessed. Findings It has been shown that some important technological parameters clearly influence the quality of the joints, and their choice is unambiguous, but the meaning of some parameters is dependent on other factors (interactions), and they should be selected experimentally. Originality/value The value of this research is that the importance of all technological factors was analyzed, which makes it easy to choose the technological procedures in the electronic packaging.

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“…3(f), was partially observed at corner side of the joint. Mei et al 9) used a nite element method and reported that the maximum thermal stress of a Ag sintered joint induced by temperature cycling was mainly generated at the corner of the joint. Navarro et al 16) also showed that the maximum normal stress was generated at the corner of the bonding interface; and it sharply decreased toward the center of the joint at 275 C. It seems reasonable that the fracture at the Ag porous bonding layer is initiated at the corner of joint.…”

Section: Non-destructive Inspection Of Ag Npb Jointmentioning

confidence: 99%

“…As an effort to eliminate the Pb containing solders in high temperature electronics, numerous alternative Pb-free bonding techniques that could be used for high temperature die attach have been reported, including high melting temperature solders, such as Au- 4) , Bi- 5) , and Zn-based 6) solders; transient liquid phase bonding 7) , and Ag sintering methods using a nanoparticle [8][9][10] or Ag nanoporous sheet 11,12) . Among these, in our previous research, we successfully demonstrated a novel die attach method using a Ag nanoporous sheet, called Ag nanoporous bonding (NPB), without the aid of the any organic substance.…”

Section: Introductionmentioning

confidence: 99%

Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

Kim

Matsunaga

et al. 2016

Mater. Trans.

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The long-term reliability of a Ag nanoporous bonding joint for high temperature die attach under temperature cycling from −55 C to 150 C was investigated. A Ag nanoporous sheet was adopted as a bonding layer for the die attach of a Si chip on an active metal brazed Cu Si 3 N 4 substrate. The initial joint strength was similar to that with Pb-5Sn die attach. There was no signi cant change in the joint strength after temperature cycling up to 1500 cycles. It was possible to con rm that the shear strength of the Ag nanoporous bonding joint had good stability under temperature cycling.

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Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver

Cited by 28 publications

References 37 publications

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Technological aspects of silver particle sintering for electronic packaging

Reliability of Ag Nanoporous Bonding Joint for High Temperature Die Attach under Temperature Cycling

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