Thermo‐mechanical properties of epoxy composites filled with inorganic particulate fillers for robust solder mask application

Abstract

Filler components play a crucial role as thermo‐mechanical reinforcement to the epoxy‐based solder mask, ensuring effective insulation and passivation. This study investigates the impact of different inorganic filler types (talc, silica (SiO2), boron nitride (BN) and barium sulfate (BaSO4)) and loadings (5 and 15 wt%) on the tensile and thermal properties of the epoxy composites. The composites were blended, cast and thermally cured. Of these composites, only 15 wt% SiO2/epoxy composite exhibits notable increments in both tensile strength and modulus, surpassing unfilled epoxy by 11.65% and 31.9%, respectively. It also displays the highest elongation at break, supported by small particle size, high specific surface area and minimal void volume fraction. For thermal tests, the addition of all fillers increases the storage modulus in both glassy and rubbery regions, especially 15 wt% talc/epoxy composite with 30.09% increment at 25 °C. Additionally, all fillers raise the glass transition temperature (Tg), notably improving it by 9 °C in the 15 wt% BN/epoxy composite. Moreover, their inclusion generally enhances the onset decomposition temperature (Tonset) and reduces weight loss during decomposition. © 2024 Society of Chemical Industry.