Thermo-mechanical evolution of ternary Bi–Sn–In solder micropowders and nanoparticles reflowed on a flexible PET substrate

Kim, Sang Hoon; Yang, Dong‐Yeol; Min, Taesik; Choi, Jin Nam; Yun, Jaecheol; Nguyen, Van Luong; Kim, Ki Bong; Kim, Young Ja; Lee, Jun Hong; Kim, Jae Won; Yang, Sangsun

doi:10.1016/j.apsusc.2016.12.050

Cited by 14 publications

(57 citation statements)

References 27 publications

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“…This low melting temperature indicates a new eutectic point for the Sn-In solder nanoparticle system, which is lower than that of the bulk alloy system (around 50 wt.% In) [9]. At higher In compositions, the Sn-In solder nanoparticles are composed of both InSn 4 and In phase [9].…”

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 88%

“…For example, the formation of an eutectic alloy with 42 wt.% Sn and 58 wt.% Bi can lead to a melting point decrease to 138°C due to the shift to the eutectic temperature [3,4]. Due to the melting point drop according to the size decrease, the size reduction effect can also be used to synthesize a low melting point solder [4].…”

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

“…At low In composition (20 wt.% In), the Sn-In solder nanoparticles were composed of InSn 4 alloy and β-Sn phase [9]. When the In content increased to 30 wt.%, the Sn-In solder nanoparticles were composed mainly of InSn 4 , with a melting temperature of 115.5°C [9]. This low melting temperature indicates a new eutectic point for the Sn-In solder nanoparticle system, which is lower than that of the bulk alloy system (around 50 wt.% In) [9].…”

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

“…Ternary Bi-Sn-In micropowders and nanoparticles were prepared as a composite solder material via gas atomization process and a chemical reduction method, respectively [3,4]. To be specific, two types of Bi-based micropowders, composed of binary Bi-Sn and ternary merits, including high wetting behavior, large creep resistance, and low coefficient of thermal expansion [12][13][14].…”

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

“…In particular, the use of wearable devices requires the development of novel solders that can be reflowed at low temperature to avoid thermal damage to the usually temperature-sensitive components in these flexible devices, such as organic light-emitting diodes (OLEDs), polymer light-emitting diodes (PLEDs), and so on [3][4][5][6]. Thus, it is worthwhile to design a low melting temperature solder for more advanced interconnection technology and thus to impart more reliability to the solder bumps between future organic-or polymer-based microchips and flexible substrates.…”

Section: Introductionmentioning

confidence: 99%

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Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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The increasing application of heat-sensitive microelectronic components such as a multitude of transistors, polymer-based microchips, and so on, and flexible polymer substrates including polyethylene terephthalate (PET) and polyimide (PI), among others, for use in wearable devices has led to the development of more advanced, low melting temperature solders (<150°C) for interconnecting components in various applications. However, the current low melting temperature solders face several key challenges, which include more intermetallic compound formation (thus become more brittle), cost issues according to the addition of supplementary elements to decrease the melting point temperature, an increase in the possibility of thermal or popcorn cracking (reliability problems), and so on. Furthermore, the low melting temperature solders are still required to possess rapid electronic/electrical transport ability (high electrical conductivity and current density) and accompany strong mechanical strength sustaining the heavy-uploaded microelectronic devices on the plastic substrates, which are at least those of the conventional melting temperature solders (180-230°C). Thus, the pursuit of more advanced low melting temperature solders for interconnections is timely. This review is devoted to the research on three methods to improve the current properties (i.e., electrical and thermomechanical properties) of low melting temperature solders: (i) doping with a small amount of certain additives, (ii) alloying with a large amount of certain additives, and (iii) reinforcing with metal, carbon, or ceramic materials. In this review, we also summarize the overall recent progress in low melting temperature solders and present a critical overview of the basis of microscopic analysis with regard to grain size and solid solutions, electrical conductivity by supplementation with conductive additives, thermal behavior (melting point and melting range) according to surface oxidation and intermetallic compound formation, and various mechanical properties.

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Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 88%

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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show abstract

A Modular Solder System with Hierarchical Morphology and Backward Compatibility

Lee

Kim

et al. 2018

Small

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A modular solder system with hierarchical morphology and micro/nanofeatures in which solder nanoparticles are distributed on the surface of template micropowders is reported. A core-shell structure of subsidiary nanostructures, which improved the intended properties of the modular solder is also presented. In addition, polymer additives can be used not only as an adhesive (like epoxy resin) but also to impart other functions. By combining all of these, it is determined that the modular solder system is able to increase reflowability on a heat-sensitive plastic substrate, oxidation resistance, and electrical conductivity. In this respect, the system could be readily modified by changing the structure and composition of each constituent and adopting backward compatibility with which the knowledge and information attained from a previously designed solder can offer feedback toward further improving the properties of a newly designed one. In practice, In-Sn-Bi nanoparticles engineered on the surface of Sn-Zn micropowders result in pronounced reflowing on a flexible Au-coated polyethylene terephthalate (PET) substrate even at the low temperature of 110 °C. Depending on their respective concentrations, the incorporation of CuO@CeO nanostructures and poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) polymers increases oxidation resistance and electrical conductivity of the modular solder.

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Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints

Lai

et al. 2018

J Mater Sci: Mater Electron

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Thermo-mechanical evolution of ternary Bi–Sn–In solder micropowders and nanoparticles reflowed on a flexible PET substrate

Cited by 14 publications

References 27 publications

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

A Modular Solder System with Hierarchical Morphology and Backward Compatibility

Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints

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