2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022
DOI: 10.1109/eptc56328.2022.10013186
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Thermo-mechanical Characterization and Stress Simulation of Epoxy Molding Compound for a High-Power Package with Silicon Nitride Passivation Layer

Zhiwen Li1,
April Jyo Garete2,
Zhou Zhou3
et al.
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