Thermo-Compression Sinter-Bonding in Air Using Cu Formate/Cu Particles Mixed During Reduction of Cu<sub>2</sub>O
Woo Lim Choi,
Jong-Hyun Lee
Abstract:A Cu-based paste containing Cu formate and Cu particles was prepared for the compressionassisted sinter-bonding of Cu-finished wide-bandgap power devices onto a Cu-finished substrate at a relatively low bonding temperature of 250 oC in air. A mixture of Cu formate and Cu particles was designed to mitigate the tremendous volume shrinkage during reduction of Cu formate, which approaches approximately 90%, and could be a significant obstacle in the formation of a high-density bond-line. The mixture was spontaneou… Show more
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