Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering

Jayachandran, B.; Prasanth, B.; Gopalan, R.; Dasgupta, Titas; Sivaprahasam, D.

doi:10.1016/j.materresbull.2020.111147

Cited by 15 publications

(18 citation statements)

References 36 publications

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“…Table shows the processing techniques and temperatures used in the literature to fabricate n-type Mg 2 (Si,Sn) with contacts. It has been reported that in n-type Mg 2 (Si,Sn) TE element fabrication, the material synthesis was carried out first and then separate contact fabrication processes were performed separately. ,,,− In addition, the contact layer oxidation and removal process are inevitable due to two different processing sequences, adding additional manufacturing costs for device fabrication.…”

Section: Resultsmentioning

confidence: 99%

“…The integration of low-cost Mg 2 Si 1– x Sn x materials in TEGs is mainly restricted by one of the leading issues, the electrical contact resistance between thermoelectric elements and contact electrodes. Several published works on Mg 2 Si 1– x Sn x focused on enhanced thermoelectric properties; ,,,,, however, the development of a suitable contact/electrode material and its joining process is minimal. ,− …”

Section: Introductionmentioning

confidence: 99%

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High-Performance Functionalized Mg₂Si_0.9Sn_0.1 Thermoelectric Leg Synthesis by a Single-Step Reactive SPS Process

Muthiah

Choudhary

Sangwan

et al. 2022

ACS Appl. Energy Mater.

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Contact electrodes and their adequate joining are the main bottlenecks in realizing low-cost Mg2(Si,Sn) thermoelectric materials for thermoelectric generator applications. The resistance and diffusion chemistry between the thermoelectric elements and contact electrodes play an essential role in achieving high-performance thermoelectric generators for intermediate-temperature applications. A facile single-step spark plasma sintering process was employed to fabricate Sb-doped Mg2Si0.9Sn0.1 and contact joining simultaneously. The single-step-processed thermoelectric element’s power output characteristics with three different contacts (Ni, MnSi, and FeSi2) were investigated by employing a thermoelectric conversion efficiency evaluation system. Our experimental strategy demonstrated that the single-step processing of Mg2(Si0.9Sn0.1)0.95Sb0.05/Ni joining imparts the lowest internal resistance and high-power output characteristics and eliminates the main obstacle of Mg2(Si,Sn) material integration in thermoelectric power generators.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

High-Performance Functionalized Mg₂Si_0.9Sn_0.1 Thermoelectric Leg Synthesis by a Single-Step Reactive SPS Process

Muthiah

Choudhary

Sangwan

et al. 2022

ACS Appl. Energy Mater.

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“…In the present work, contact resistances as low as ~43–59 mΩ.mm 2 were obtained in tetrahedrite legs/copper junctions. These values are close to the range reported for commercial TE devices (typically from 0.075 to 3.7 mΩ.mm 2 ) [ 51 , 52 , 53 ] and to other TE materials currently being studied, such as the skutterudites (~10–12 mΩ.mm 2 ) [ 54 ], the CoSb 3 compounds (~ 15 mΩ.mm 2 ) [ 55 ], and the Mg 2 (Si,Sn) legs (~1–20 mΩ.mm 2 ) [ 56 , 57 ].…”

Section: Computer Simulationsmentioning

confidence: 99%

An Electrical Contacts Study for Tetrahedrite-Based Thermoelectric Generators

Coelho

Abreu²,

Carvalho

et al. 2022

Materials

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High electrical and thermal contact resistances can ruin a thermoelectric device’s performance, and thus, the use of effective diffusion barriers and optimization of joining methods are crucial to implement them. In this work, the use of carbon as a Cu11Mn1Sb4S13 tetrahedrite diffusion barrier, and the effectiveness of different fixation techniques for the preparation of tetrahedrite/copper electrical contacts were investigated. Contacts were prepared using as jointing materials Ni and Ag conductive paints and resins, and a Zn-5wt% Al solder. Manual, cold- and hot-pressing fixation techniques were explored. The contact resistance was measured using a custom-made system based on the three points pulsed-current method. The legs interfaces (Cu/graphite/tetrahedrite) were investigated by optical and scanning electron microscopies, complemented with energy-dispersive X-ray spectroscopy, and X-ray diffraction. No interfacial phases were formed between the graphite and the tetrahedrite or Cu, pointing to graphite as a good diffusion barrier. Ag water-based paint was the best jointing material, but the use of hot pressing without jointing materials proves to be the most reliable technique, presenting the lowest contact resistance values. Computer simulations using the COMSOL software were performed to complement this study, indicating that high contact resistances strongly reduce the power output of thermoelectric devices.

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“…During fabrication or subsequent operation at elevated temperatures, the contamination of the TE material by elements from electrodes could alter its properties. This process, referred to as “poisoning”, is a major problem in direct TE material-electrode contacts, particularly for medium and high-temperature applications. ,, The stress developed at the contacts due to the thermal expansion coefficient (CTE) mismatch is another critical issue in TE devices. An appropriate choice of electrode material and contact design is thus crucial to overcome this problem.…”

Section: Introductionmentioning

confidence: 99%

Highly Stable Metal─Na_0.02Pb_0.98Te Contacts for Medium Temperature Thermoelectric Devices

Jayachandran

Dasgupta

Sivaprahasam

2023

ACS Appl. Mater. Interfaces

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In the medium temperature (600−850 K) range, Na 0.02 Pb 0.98 Te is a highly efficient p-type thermoelectric compound. Device fabrication utilizing this compound for power generation demands highly stable low-contact resistance contacts with metal electrodes. This work investigates the microstructural, electrical, mechanical, and thermochemical stability of Na 0.02 Pb 0.98 Te−metal (Ni, Fe, and Co) contacts made by a one-step vacuum hot pressing process. Direct contact mostly resulted in either an interface with poor mechanical integrity, as in Co and Fe, or poisoning of the TE compound, as in the case of Ni, which results in high specific contact resistance (r c ). In Ni and Co, adding a SnTe interlayer lowers the r c and strengthens the contact. It does not, however, effectively stop Ni from diffusing into Na 0.02 Pb 0.98 Te. The bonding is poor in the Fe/SnTe/Na 0.02 Pb 0.98 Te contacts due to the absence of any reaction at the Fe/SnTe interface. A composite buffer layer Co + 75 vol % SnTe with SnTe improves the mechanical stability of the Co contact with moderately lesser r c than pure SnTe alone. However, a similar approach with Fe does not yield stable contact. The Co/Co + 75 vol % SnTe/SnTe/Na 0.02 Pb 0.98 Te contact exhibits r c less than 50 μΩ cm 2 and has good microstructural and mechanical stability after annealing at 723 K for 170 h.

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Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering

Cited by 15 publications

References 36 publications

High-Performance Functionalized Mg₂Si_0.9Sn_0.1 Thermoelectric Leg Synthesis by a Single-Step Reactive SPS Process

High-Performance Functionalized Mg₂Si_0.9Sn_0.1 Thermoelectric Leg Synthesis by a Single-Step Reactive SPS Process

An Electrical Contacts Study for Tetrahedrite-Based Thermoelectric Generators

Highly Stable Metal─Na_0.02Pb_0.98Te Contacts for Medium Temperature Thermoelectric Devices

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Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering

Cited by 15 publications

References 36 publications

High-Performance Functionalized Mg2Si0.9Sn0.1 Thermoelectric Leg Synthesis by a Single-Step Reactive SPS Process

High-Performance Functionalized Mg2Si0.9Sn0.1 Thermoelectric Leg Synthesis by a Single-Step Reactive SPS Process

An Electrical Contacts Study for Tetrahedrite-Based Thermoelectric Generators

Highly Stable Metal─Na0.02Pb0.98Te Contacts for Medium Temperature Thermoelectric Devices

Contact Info

Product

Resources

About

High-Performance Functionalized Mg₂Si_0.9Sn_0.1 Thermoelectric Leg Synthesis by a Single-Step Reactive SPS Process

High-Performance Functionalized Mg₂Si_0.9Sn_0.1 Thermoelectric Leg Synthesis by a Single-Step Reactive SPS Process

Highly Stable Metal─Na_0.02Pb_0.98Te Contacts for Medium Temperature Thermoelectric Devices